Ceramic Capacitors

Image	Part Number	Description / PDF	Quantity	Rfq
	B37986N5472J054 TDK EPCOS	CAP CER 4700PF 50V NP0 RADIAL	0
	B37987F1104K058 TDK EPCOS	CAP CER 0.1UF 100V X7R RADIAL	0
	B37950K2103K062 TDK EPCOS	CAP CER 10000PF 200V X7R 1210	0
	B37949K1152J062 TDK EPCOS	CAP CER 1500PF 100V NP0 1210	0
	B37987F1223K058 TDK EPCOS	CAP CER 0.022UF 100V X7R RADIAL	0
	B37950K2392K062 TDK EPCOS	CAP CER 3900PF 200V X7R 1210	0
	B37950K1473K062 TDK EPCOS	CAP CER 0.047UF 100V X7R 1210	0
	B37987F1223K054 TDK EPCOS	CAP CER 0.022UF 100V X7R RADIAL	0
	B37979G1101J054 TDK EPCOS	CAP CER 100PF 100V NP0 RADIAL	0
	B37950K2223K062 TDK EPCOS	CAP CER 0.022UF 200V X7R 1210	0
	B37981M5473K054 TDK EPCOS	CAP CER 0.047UF 50V X7R RADIAL	0

Ceramic Capacitors

1. Overview

Ceramic capacitors are fixed-value capacitors with ceramic materials as dielectrics. They consist of alternating layers of ceramic and metal electrodes, offering compact size, low cost, and stable performance. As core passive components, they are critical in modern electronics for functions like noise filtering, signal coupling, and power supply stabilization. Their importance spans from consumer electronics to aerospace systems due to their reliability and wide operating frequency range.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Class I Ceramic Capacitors	High stability, low losses, linear temperature coefficient ( 30ppm/ C)	RF circuits, precision oscillators
Class II Ceramic Capacitors	Higher capacitance density, nonlinear temperature response ( 15%-22%)	Power decoupling, DC link circuits
Multi-Layer Ceramic Capacitors (MLCCs)	Stacked electrode structure, high capacitance-to-volume ratio	Mobile devices, automotive electronics
High Voltage Ceramic Capacitors	Rated voltage >1kV, thick dielectric layers	Power supplies, medical imaging equipment

3. Structure and Composition

Ceramic capacitors feature a layered structure with three primary components:

Ceramic Dielectric: Barium titanate (BaTiO3) or calcium zirconate formulations for Class II/III types
Electrodes: Nickel, copper, or silver-palladium alloys in alternating layers
Terminations: Solderable outer layers (e.g., tin/nickel plating) for PCB mounting

MLCCs are manufactured through tape casting, screen printing, and sintering processes to create monolithic structures with up to 1000+ electrode layers.

4. Key Technical Specifications

Parameter	Significance	Typical Range
Capacitance (C)	Determines charge storage capability	0.5pF - 100 F
Rated Voltage (VR)	Maximum DC working voltage	2.5V - 10kV
Capacitance Tolerance	Manufacturing accuracy	1% (Class I) to 22% (Class III)
Temperature Coefficient	Stability across temperature	-55 C to +125 C operating range
ESR (Equivalent Series Resistance)	Impacts high-frequency performance	1m - 100m

5. Application Fields

Ceramic capacitors are deployed in:

Consumer Electronics: Smartphones (decoupling), laptops (power management)
Automotive Systems: ECU units (noise suppression), EV charging circuits
Industrial Equipment: Motor drives (snubber circuits), PLC controllers
Telecommunications: 5G base stations (RF filtering), optical transceivers
Medical Devices: MRI scanners (high-voltage isolation), pacemakers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Technical Highlights
Murata Manufacturing	GRM series MLCCs	Sub-millimeter 0201 size with 10 F capacity
TDK Corporation	C4532 series	High-reliability automotive grade components
KEMET Electronics	C1210 series	Space-grade tantalum ceramic hybrid capacitors
AVX Corporation	943D series	High-voltage 2000V surface-mount devices
Vishay Intertechnology	VCB series	Anti-sulfurated terminations for harsh environments

7. Selection Guidelines

Key considerations for capacitor selection:

Operating voltage margin (>20% above rated voltage)
Temperature stability requirements (Class I for precision circuits)
Size constraints (MLCCs preferred for miniaturization)
Environmental factors (humidity, vibration, thermal cycling)
Cost optimization (Class II for cost-sensitive applications)

Example: For a 5G RF front-end module, select Class I capacitors with 0.1pF tolerance and 50 impedance matching characteristics.

8. Industry Trends

Emerging developments include:

Miniaturization: Development of 01005-inch MLCCs for wearable devices
High Capacitance Density: 100 F+ in 1210 package through nano-dielectric engineering
Advanced Materials: Lead-free ceramics meeting RoHS standards
High-Temperature Performance: Capacitors operating reliably at 200 C+
Integrated Solutions: Embedded capacitor substrates for SiP (System-in-Package) applications