Ceramic Capacitors

Part Number	Description / PDF	Quantity
MC02CTN5002R2 Viking Tech	CAP CER 2.2PF 50V C0G/NP0 0402	0
MC02KTX6V3224 Viking Tech	CAP CER 0.22UF 6.3V X5R 0402	0
MC05JTN500150 Viking Tech	CAP CER 15PF 50V C0G/NP0 0805	4000
MC02JTN500100 Viking Tech	CAP CER 10PF 50V C0G/NP0 0402	0
MC05JTN500180 Viking Tech	CAP CER 18PF 50V C0G/NP0 0805	0
MC02KTB500102 Viking Tech	CAP CER 1000PF 50V X7R 0402	0
MC05JTN500120 Viking Tech	CAP CER 12PF 50V C0G/NP0 0805	4000
MC02JTN500120 Viking Tech	CAP CER 12PF 50V C0G/NP0 0402	0
MC01JTX100222 Viking Tech	CAP CER 2200PF 10V X5R 0201	0
MC01JTX100102 Viking Tech	CAP CER 1000PF 10V X5R 0201	0

Ceramic Capacitors

1. Overview

Ceramic capacitors are fixed-value capacitors with ceramic materials as dielectrics. They consist of alternating layers of ceramic and metal electrodes, offering compact size, low cost, and stable performance. As core passive components, they are critical in modern electronics for functions like noise filtering, signal coupling, and power supply stabilization. Their importance spans from consumer electronics to aerospace systems due to their reliability and wide operating frequency range.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Class I Ceramic Capacitors	High stability, low losses, linear temperature coefficient ( 30ppm/ C)	RF circuits, precision oscillators
Class II Ceramic Capacitors	Higher capacitance density, nonlinear temperature response ( 15%-22%)	Power decoupling, DC link circuits
Multi-Layer Ceramic Capacitors (MLCCs)	Stacked electrode structure, high capacitance-to-volume ratio	Mobile devices, automotive electronics
High Voltage Ceramic Capacitors	Rated voltage >1kV, thick dielectric layers	Power supplies, medical imaging equipment

3. Structure and Composition

Ceramic capacitors feature a layered structure with three primary components:

Ceramic Dielectric: Barium titanate (BaTiO3) or calcium zirconate formulations for Class II/III types
Electrodes: Nickel, copper, or silver-palladium alloys in alternating layers
Terminations: Solderable outer layers (e.g., tin/nickel plating) for PCB mounting

MLCCs are manufactured through tape casting, screen printing, and sintering processes to create monolithic structures with up to 1000+ electrode layers.

4. Key Technical Specifications

Parameter	Significance	Typical Range
Capacitance (C)	Determines charge storage capability	0.5pF - 100 F
Rated Voltage (VR)	Maximum DC working voltage	2.5V - 10kV
Capacitance Tolerance	Manufacturing accuracy	1% (Class I) to 22% (Class III)
Temperature Coefficient	Stability across temperature	-55 C to +125 C operating range
ESR (Equivalent Series Resistance)	Impacts high-frequency performance	1m - 100m

5. Application Fields

Ceramic capacitors are deployed in:

Consumer Electronics: Smartphones (decoupling), laptops (power management)
Automotive Systems: ECU units (noise suppression), EV charging circuits
Industrial Equipment: Motor drives (snubber circuits), PLC controllers
Telecommunications: 5G base stations (RF filtering), optical transceivers
Medical Devices: MRI scanners (high-voltage isolation), pacemakers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Technical Highlights
Murata Manufacturing	GRM series MLCCs	Sub-millimeter 0201 size with 10 F capacity
TDK Corporation	C4532 series	High-reliability automotive grade components
KEMET Electronics	C1210 series	Space-grade tantalum ceramic hybrid capacitors
AVX Corporation	943D series	High-voltage 2000V surface-mount devices
Vishay Intertechnology	VCB series	Anti-sulfurated terminations for harsh environments

7. Selection Guidelines

Key considerations for capacitor selection:

Operating voltage margin (>20% above rated voltage)
Temperature stability requirements (Class I for precision circuits)
Size constraints (MLCCs preferred for miniaturization)
Environmental factors (humidity, vibration, thermal cycling)
Cost optimization (Class II for cost-sensitive applications)

Example: For a 5G RF front-end module, select Class I capacitors with 0.1pF tolerance and 50 impedance matching characteristics.

8. Industry Trends

Emerging developments include:

Miniaturization: Development of 01005-inch MLCCs for wearable devices
High Capacitance Density: 100 F+ in 1210 package through nano-dielectric engineering
Advanced Materials: Lead-free ceramics meeting RoHS standards
High-Temperature Performance: Capacitors operating reliably at 200 C+
Integrated Solutions: Embedded capacitor substrates for SiP (System-in-Package) applications