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Modular - Flat Cable

Image Part Number Description / PDF Quantity Rfq
1301190001

1301190001

Woodhead - Molex

CABLE MOD FLAT 4COND YELLOW 1'

0
1301190005

1301190005

Woodhead - Molex

CABLE MOD FLAT 12COND YELLOW 1'

0
1301190004

1301190004

Woodhead - Molex

CABLE MOD FLAT 8COND YELLOW 1'

0
1301190003

1301190003

Woodhead - Molex

CABLE MOD FLAT 4COND YELLOW 1'

0
1301190008

1301190008

Woodhead - Molex

CABLE MOD FLAT 4COND YELLOW 1'

0
1301190006

1301190006

Woodhead - Molex

CABLE MOD FLAT 8COND YELLOW 1'

0
1301190002

1301190002

Woodhead - Molex

CABLE MOD FLAT 8COND YELLOW 1'

0
1301190007

1301190007

Woodhead - Molex

CABLE MOD FLAT 12COND YELLOW 1'

0

Modular - Flat Cable

1. Overview

Modular flat cables are flexible, multi-conductor cables with a low-profile design, enabling high-density electrical connections. Their parallel conductor arrangement within a flat dielectric substrate offers advantages in space-saving, signal integrity, and mechanical flexibility. These cables are critical in modern electronics, automotive systems, industrial automation, and telecommunications, where compactness and reliable performance are essential.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Ribbon CableParallel conductors in PVC/PE insulation, low-cost mass productionComputer peripherals, internal PCB connections
FPC (Flexible Printed Circuit)Etched copper traces on polyimide substrate, dynamic flexing capabilitySmartphones, wearable devices
FFC (Flexible Flat Cable)ZIF (Zero Insertion Force) connectors, standardized pitch sizesLCD panels, camera modules
High-Speed Data CableTwisted pair configurations, controlled impedanceIndustrial Ethernet, automotive infotainment

3. Structure and Composition

A typical modular flat cable consists of three primary layers:

  • Conductors: Annealed copper or copper alloys (e.g., C19400) with cross-sectional areas from 0.035mm to 0.5mm
  • Insulation: Thermoplastic polyurethane (TPU) or polyethylene terephthalate (PET) films with thickness 0.05-0.2mm
  • Shielding: Optional aluminum-polyester foil or braided copper mesh for EMI protection

Advanced designs incorporate adhesiveless lamination processes and laser-marked identification codes for traceability.

4. Key Technical Parameters

ParameterTypical RangeSignificance
Conductor Cross-Section0.035-0.5mm Determines current-carrying capacity
Working Temperature-40 C to +125 CDefines operational environmental limits
Bending Cycle Life10,000-100,000 cyclesIndicates mechanical durability
Impedance Control50-100 Ensures signal integrity in high-speed applications
Dielectric Withstanding Voltage300-1000VACSpecifies electrical safety margins

5. Application Fields

Primary industries utilizing modular flat cables include:

  • Consumer Electronics: Smartphones (camera-flex connections), laptops (display hinges)
  • Industrial Automation: Robotic arms (dynamic cable tracks), CNC machines
  • Automotive: ADAS camera systems, door module wiring harnesses
  • Medical Equipment: MRI scanners (rotary joint connections), portable diagnostics
  • Telecommunications: 5G base stations (RF interconnects), data center switches

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
MolexSL Series FFC0.5mm pitch, 30-position configurations
TE ConnectivityHDM Flat CableHigh-speed differential pairs, RoHS compliant
AmphenolFlex Speed+10Gbps data rate, halogen-free materials
Hitachi CableUltra-Flex FPCDynamic bending life >50,000 cycles

7. Selection Guidelines

Key considerations for optimal cable selection:

  1. Environmental Conditions: Operating temperature, chemical exposure, and vibration levels
  2. Electrical Requirements: Voltage/current ratings, signal frequency, and shielding needs
  3. Mechanical Constraints: Bending radius (minimum 5 cable thickness recommended), mating force limitations
  4. Termination Compatibility: Connector type (ZIF, LIF) and pitch alignment precision
  5. Cost Efficiency: Balance between material specifications and application demands

8. Industry Trends Analysis

Market forecasts indicate a CAGR of 6.2% through 2030, driven by:

  • Miniaturization: Sub-0.3mm pitch cables entering mass production (JEITA standards)
  • Material Innovation: Development of self-healing polymer insulation and graphene-reinforced conductors
  • Integration Trends: Embedded passive components within flat cable structures
  • Environmental Compliance: Transition to bio-based polymers and lead-free manufacturing
  • Automated Assembly: Adoption of machine-readable cable identification systems
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