| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Parlex Corp. |
CABLE FFC 35COND 0.100" 500' |
0 |
|
|
Parlex Corp. |
CABLE FLAT FLEX 45COND 0.050" |
0 |
|
|
Parlex Corp. |
CABLE FLAT FLEX 15COND 0.050" |
0 |
|
|
Parlex Corp. |
CABLE FLAT FLEX 24COND 0.050" |
0 |
|
|
Storage & Server IO (Amphenol ICC) |
SATA PLUG |
0 |
|
|
Parlex Corp. |
CABLE FLAT FLEX 29COND 0.050" |
0 |
|
|
Parlex Corp. |
CABLE FFC 31COND 0.100" 500' |
0 |
|
|
Parlex Corp. |
CABLE FFC 36COND 0.100" 500' |
0 |
|
|
Parlex Corp. |
CABLE FLAT FLEX 30COND 0.050" |
0 |
|
|
Parlex Corp. |
CABLE FLAT FLEX 9COND 0.050" |
0 |
|
|
Parlex Corp. |
CABLE FFC 29COND 0.100" 500' |
0 |
|
|
Parlex Corp. |
CABLE FFC 26COND 0.100" 500' |
0 |
|
|
Parlex Corp. |
CABLE FFC 33COND 0.100" 500' |
0 |
|
|
Parlex Corp. |
CABLE FFC 22COND 0.100" 500' |
0 |
|
|
Parlex Corp. |
CABLE FFC 27COND 0.100" 500' |
0 |
|
|
Parlex Corp. |
CABLE FLAT FLEX 55COND 0.050" |
0 |
|
|
Parlex Corp. |
CABLE FFC 17COND 0.100" 500' |
0 |
|
|
Parlex Corp. |
CABLE FLAT FLEX 13COND 0.050" |
0 |
|
|
Parlex Corp. |
CABLE FFC 21COND 0.100" 500' |
0 |
|
|
Parlex Corp. |
CABLE FLAT FLEX 36COND 0.050" |
0 |
|
Flat Flex Cables (FFC) and Flexible Printed Circuits (FPC) are thin, lightweight wiring solutions used for high-density interconnects in compact electronic devices. FFCs are typically made of flat copper conductors bonded to insulating films, while FPCs are printed circuits on flexible substrates. They enable reliable signal/power transmission in constrained spaces, playing a critical role in modern electronics such as smartphones, wearables, and automotive systems.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| FFC - Single-Sided | Conductors on one side, cost-effective, bendable | Laptop hinges, printers |
| FFC - Double-Sided | Conductors on both sides, higher density | Medical imaging devices |
| FPC - Single-Layer | Single conductive layer, lightweight | Smartphones, sensors |
| FPC - Multi-Layer | Multiple layers with vias, complex routing | High-end servers, aerospace systems |
| FFC/FPC Hybrid | Combines rigid and flexible sections | Industrial robots, automotive ECUs |
A typical FFC/FPC consists of:
- Conductive Layer: Annealed copper (0.035-0.1mm thickness) for FFC; copper-clad laminates for FPC
- Dielectric Substrate: Polyethylene terephthalate (PET) or polyimide (PI) films (0.05-0.2mm)
- Adhesive Layer: Acrylic or epoxy-based materials for bonding layers
- Surface Finish: Gold, tin, or nickel plating for corrosion resistance
- Reinforcement: Stiffeners (polyester, steel) for connector zones
| Parameter | Importance |
|---|---|
| Conductor Width/Spacing | Determines current capacity and signal integrity (Typ: 0.1-2.0mm) |
| Insulation Resistance | Must exceed 100M to prevent leakage (Test Voltage: 500V DC) |
| Flex Life | Rated for 10,000+ bending cycles (ASTM B543 compliance) |
| Temperature Range | Operating: -40 C to +125 C; Storage: -55 C to +150 C |
| Impedance Control | Controlled to 50-100 for high-speed signals (USB 3.0, HDMI) |
Consumer Electronics: Foldable smartphones, tablets, wearable fitness trackers
Automotive: Dashboard clusters, ADAS sensors, infotainment systems
Medical: MRI machines, endoscopes, patient monitors
Industrial: CNC machines, drones, automation robots
Aerospace: Avionics, satellite systems, flight control units
| Manufacturer | Representative Product |
|---|---|
| Molex | MicroSlim FFC (0.2mm pitch, 30-position) |
| TE Connectivity | FPC-Link II (High-speed automotive camera links) |
| Hirose Electric | FH35 Series (0.4mm pitch ZIF connectors) |
| JAE Electronics | DF11 Series (FPC-to-board connectors) |
| 3M | Flexible Circuit Materials (Adhesives & Coverlays) |
Key considerations:
1. Application Type: Choose FPC for complex routing, FFC for low-cost solutions
2. Environmental Stress: Select PI substrates for high temperatures (>100 C)
3. Signal Requirements: Use impedance-controlled designs for >1Gbps signals
4. Space Constraints: Opt for ultra-thin ( 0.2mm) cables for foldable devices
5. Production Volume: FPC requires higher NRE but lower unit cost at scale
- Miniaturization: 0.1mm pitch connectors entering mass production (2023 market growth: 12% YoY)
- High-Speed Capabilities: Development of 10Gbps+ FPCs for 5G infrastructure
- Material Innovation: Graphene-enhanced conductors for improved thermal dissipation
- Integration: Embedded passive components in FPCs reducing system complexity
- Sustainability: Halogen-free materials and recyclable substrates (EU RoHS compliance)