Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
2906950

2906950

Phoenix Contact

ASSEMBLED SHIELDED ROUND CABLE F

0

1415003

1415003

Phoenix Contact

CABLE 3POS

17

2909747

2909747

Phoenix Contact

CAB-TE MR24F/OE/24/S/ 3M

0

1410735

1410735

Phoenix Contact

SAC-2P-10 0-PUR/DTFS-1L-S

0

1415035

1415035

Phoenix Contact

CABLE 6POS

0

1415006

1415006

Phoenix Contact

CABLE 3POS

0

1414994

1414994

Phoenix Contact

CABLE 2POS

34

1410728

1410728

Phoenix Contact

SAC-2P- 1 5-PUR/DTFS-1L

98

2906952

2906952

Phoenix Contact

ASSEMBLED SHIELDED ROUND CABLE F

0

2909731

2909731

Phoenix Contact

CAB-TE MR36F/OE/24/S/ 1M

16

2909746

2909746

Phoenix Contact

CAB-TE MR24F/OE/24/S/ 1M

8

1415008

1415008

Phoenix Contact

CABLE 4POS

0

1415026

1415026

Phoenix Contact

CABLE 4POS

0

1415012

1415012

Phoenix Contact

CABLE 4POS

132

1415030

1415030

Phoenix Contact

CABLE 6POS

0

2295512

2295512

Phoenix Contact

CABLE SOCKET-SOCKET

0

2318693/1.500

2318693/1.500

Phoenix Contact

CABLE ASSEMBLY INTERFACE 1.5M

0

2296207

2296207

Phoenix Contact

CABLE SOCKET-SOCKET

0

2304788

2304788

Phoenix Contact

CABLE SOCKET-SOCKET

0

2302418

2302418

Phoenix Contact

CABLE SOCKET-SOCKET

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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