Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
10129553-14430WALF

10129553-14430WALF

Storage & Server IO (Amphenol ICC)

SATA PLUG

0

10127624-13961T0LF

10127624-13961T0LF

Storage & Server IO (Amphenol ICC)

CABLE ASSSY

0

10127624-13616TALF

10127624-13616TALF

Storage & Server IO (Amphenol ICC)

FLEX CABLE BGA 79HJY 1

0

10127624-13610T0LF

10127624-13610T0LF

Storage & Server IO (Amphenol ICC)

CABLE ASSSY

0

10137728-P0015YYLF

10137728-P0015YYLF

Storage & Server IO (Amphenol ICC)

CTW CABLE ASSEMBLY

0

10129553-14428MALF

10129553-14428MALF

Storage & Server IO (Amphenol ICC)

SATA PLUG

0

10134896-R0028YYLF

10134896-R0028YYLF

Storage & Server IO (Amphenol ICC)

CTW CABLE ASSY 0.275M

0

10127624-13962T0LF

10127624-13962T0LF

Storage & Server IO (Amphenol ICC)

CABLE ASSSY

0

10123462-R0026YYLF

10123462-R0026YYLF

Storage & Server IO (Amphenol ICC)

HEADER BERGSTIK

0

10152729-001LF

10152729-001LF

Storage & Server IO (Amphenol ICC)

MINITEK 5.7PWR CABLE ASS

0

10080594-4UA0022LF

10080594-4UA0022LF

Storage & Server IO (Amphenol ICC)

1P+24S+1P PWR-BLADE ASSY

0

10080598-2ED0003LF

10080598-2ED0003LF

Storage & Server IO (Amphenol ICC)

CONN RCPT

0

10127624-13608MALF

10127624-13608MALF

Storage & Server IO (Amphenol ICC)

CABLE ASSSY

0

10153095-P0100YYLF

10153095-P0100YYLF

Storage & Server IO (Amphenol ICC)

MICROSPACE CABLE ASS

0

10127624-13615M0LF

10127624-13615M0LF

Storage & Server IO (Amphenol ICC)

CABLE ASSSY

0

10129542-P0013YYLF

10129542-P0013YYLF

Storage & Server IO (Amphenol ICC)

SATA PLUG

0

10127624-13962WALF

10127624-13962WALF

Storage & Server IO (Amphenol ICC)

FLEX CABLE BGA 632Y9 1

0

10080594-3CD0160LF

10080594-3CD0160LF

Storage & Server IO (Amphenol ICC)

CONN RCPT

0

10127624-13615M1LF

10127624-13615M1LF

Storage & Server IO (Amphenol ICC)

CABLE ASSSY

0

10134631-P0013YYLF

10134631-P0013YYLF

Storage & Server IO (Amphenol ICC)

CTW CABLE ASSY 0.13M

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
RFQ BOM Call Skype Email
Top