Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
10123475-R0003YYLF

10123475-R0003YYLF

Storage & Server IO (Amphenol ICC)

HEADER BERGSTIK

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10129553-14531WALF

10129553-14531WALF

Storage & Server IO (Amphenol ICC)

SATA PLUG

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10080594-7FC0195LF

10080594-7FC0195LF

Storage & Server IO (Amphenol ICC)

PWRBLADE 3ACP24S2P ASS'Y

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10129553-14428WALF

10129553-14428WALF

Storage & Server IO (Amphenol ICC)

SATA PLUG

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10121131-P0010YYLF

10121131-P0010YYLF

Storage & Server IO (Amphenol ICC)

CONN HEADER STRT

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10080594-3CA0156LF

10080594-3CA0156LF

Storage & Server IO (Amphenol ICC)

CONN RCPT

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10127624-13615TALF

10127624-13615TALF

Storage & Server IO (Amphenol ICC)

FLEX CABLE BGA W3N15 1

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10137071-P0029YYLF

10137071-P0029YYLF

Storage & Server IO (Amphenol ICC)

CTW CABLE ASSEMBLY

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10127624-13614TALF

10127624-13614TALF

Storage & Server IO (Amphenol ICC)

FLEX CABLE BGA 8CGW7 1

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10129553-14423WALF

10129553-14423WALF

Storage & Server IO (Amphenol ICC)

FLEX CABLE BGA THH7P 1

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10129553-14425M0LF

10129553-14425M0LF

Storage & Server IO (Amphenol ICC)

SATA PLUG

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10129553-14460WALF

10129553-14460WALF

Storage & Server IO (Amphenol ICC)

FLEX CABLE BGA THH7P 1

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10129553-14429MALF

10129553-14429MALF

Storage & Server IO (Amphenol ICC)

SATA PLUG

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10129553-14429M1LF

10129553-14429M1LF

Storage & Server IO (Amphenol ICC)

SATA PLUG

0

10127624-13613M2LF

10127624-13613M2LF

Storage & Server IO (Amphenol ICC)

CABLE ASSSY

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10129553-14429WALF

10129553-14429WALF

Storage & Server IO (Amphenol ICC)

SATA PLUG

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10129553-14426TALF

10129553-14426TALF

Storage & Server IO (Amphenol ICC)

FLEX CABLE BGA N8P1J 1

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10129553-14531M0LF

10129553-14531M0LF

Storage & Server IO (Amphenol ICC)

SATA PLUG

0

10127624-13658TALF

10127624-13658TALF

Storage & Server IO (Amphenol ICC)

FLEX CABLE BGA G3TV9 1

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10114526-Z0200YYLF

10114526-Z0200YYLF

Storage & Server IO (Amphenol ICC)

XCEDE RIGHT

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Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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