Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
A8MMS-2436G

A8MMS-2436G

TE Connectivity AMP Connectors

ADM24S/AE24G/ADM24S

0

A3CCH-6018G

A3CCH-6018G

TE Connectivity AMP Connectors

IDC CABLE - AKC60H/AE60G/AKC60H

0

A8MMS-2418G

A8MMS-2418G

TE Connectivity AMP Connectors

ADM24S/AE24G/ADM24S

0

A3AAB-5006G

A3AAB-5006G

TE Connectivity AMP Connectors

IDC CABLE- ASC50B/AE50G/ASC50B

0

A3AAB-2036G

A3AAB-2036G

TE Connectivity AMP Connectors

IDC CABLE- ASC20B/AE20G/ASC20B

0

A8MMS-5006G

A8MMS-5006G

TE Connectivity AMP Connectors

ADM50S/AE50G/ADM50S

0

A3CKB-1436G

A3CKB-1436G

TE Connectivity AMP Connectors

IDC CABLE - AKC14B/AE14G/APK14B

0

A1DXB-2036G

A1DXB-2036G

TE Connectivity AMP Connectors

IDC CABLE- AKR20B/AE20G/X

0

A1CXB-1636M

A1CXB-1636M

TE Connectivity AMP Connectors

IDC CABLE- AKC16B/AE16M/X

0

A3DDB-5006G

A3DDB-5006G

TE Connectivity AMP Connectors

IDC CABLE- AKR50B/AE50G/AKR50B

0

A6MMS-5018M

A6MMS-5018M

TE Connectivity AMP Connectors

IDC CABLE - ADM50S/AE50M/ADM50S

0

2205117-1

2205117-1

TE Connectivity AMP Connectors

CA 75MM 14 POS. MOW-PB M-M VALUE

21

A2MXS-5036G

A2MXS-5036G

TE Connectivity AMP Connectors

ADM50S/AE50G/X

0

A3AAB-1006M

A3AAB-1006M

TE Connectivity AMP Connectors

IDC CABLE- ASC10B/AE10M/ASC10B

0

A3DKB-6406M

A3DKB-6406M

TE Connectivity AMP Connectors

IDC CABLE - AKR64B/AE64M/APK64B

0

A1KXB-1636M

A1KXB-1636M

TE Connectivity AMP Connectors

IDC CABLE - APK16B/AE16M/X

0

A3CCH-4036M

A3CCH-4036M

TE Connectivity AMP Connectors

IDC CABLE - AKC40H/AE40M/AKC40H

0

A3KKB-1018M

A3KKB-1018M

TE Connectivity AMP Connectors

IDC CABLE - APK10B/AE10M/APK10B

0

A3AAH-1436G

A3AAH-1436G

TE Connectivity AMP Connectors

IDC CABLE - ASC14H/AE14G/ASC14H

0

A1RXB-1636M

A1RXB-1636M

TE Connectivity AMP Connectors

IDC CABLE - APR16B/AE16M/X

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
RFQ BOM Call Skype Email
Top