Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
A3BBH-3436M

A3BBH-3436M

TE Connectivity AMP Connectors

IDC CABLE - ASR34H/AE34M/ASR34H

0

A1KXB-1436G

A1KXB-1436G

TE Connectivity AMP Connectors

IDC CABLE - APK14B/AE14G/X

0

A3AAH-2636G

A3AAH-2636G

TE Connectivity AMP Connectors

IDC CABLE - ASC26H/AE26G/ASC26H

0

A3DDH-3036M

A3DDH-3036M

TE Connectivity AMP Connectors

IDC CABLE - AKR30H/AE30M/AKR30H

0

A3AKB-2006M

A3AKB-2006M

TE Connectivity AMP Connectors

IDC CABLE - ASC20B/AE20M/APK20B

0

1483350-3

1483350-3

TE Connectivity AMP Connectors

MICRO-MATCH LEAD 04P 250MM

643

A8MMS-4036G

A8MMS-4036G

TE Connectivity AMP Connectors

ADM40S/AE40G/ADM40S

0

2205112-1

2205112-1

TE Connectivity AMP Connectors

CA 75MM 04 POS. MOW-PB M-M VALUE

401

A6MMS-6406G

A6MMS-6406G

TE Connectivity AMP Connectors

IDC CABLE - ADM64S/AE64G/ADM64S

0

A1AXB-1436G

A1AXB-1436G

TE Connectivity AMP Connectors

IDC CABLE- ASC14B/AE14G/X

0

A3AKB-1636G

A3AKB-1636G

TE Connectivity AMP Connectors

IDC CABLE - ASC16B/AE16G/APK16B

0

A3CCB-2618G

A3CCB-2618G

TE Connectivity AMP Connectors

IDC CABLE- AKC26B/AE26G/AKC26B

0

A3BBB-1636M

A3BBB-1636M

TE Connectivity AMP Connectors

IDC CABLE- ASR16B/AE16M/ASR16B

0

A3DDB-3406M

A3DDB-3406M

TE Connectivity AMP Connectors

IDC CABLE- AKR34B/AE34M/AKR34B

0

A8MMS-3436M

A8MMS-3436M

TE Connectivity AMP Connectors

ADM34S/AE34M/ADM34S

0

A3DKB-4018G

A3DKB-4018G

TE Connectivity AMP Connectors

IDC CABLE - AKR40B/AE40G/APK40B

0

A3BBH-2606M

A3BBH-2606M

TE Connectivity AMP Connectors

IDC CABLE - ASR26H/AE26M/ASR26H

0

A1DXH-2636M

A1DXH-2636M

TE Connectivity AMP Connectors

IDC CABLE - AKR26H/AE26M/X

0

A1CXB-1036G

A1CXB-1036G

TE Connectivity AMP Connectors

IDC CABLE- AKC10B/AE10G/X

0

A3BKB-2636G

A3BKB-2636G

TE Connectivity AMP Connectors

IDC CABLE- ASR26B/AE26G/APK26B

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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