Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
A3CCH-5006G

A3CCH-5006G

TE Connectivity AMP Connectors

IDC CABLE - AKC50H/AE50G/AKC50H

0

A3CCB-3406M

A3CCB-3406M

TE Connectivity AMP Connectors

IDC CABLE- AKC34B/AE34M/AKC34B

0

A3RRB-1036M

A3RRB-1036M

TE Connectivity AMP Connectors

IDC CABLE - APR10B/AE10M/APR10B

0

A6MMS-3436G

A6MMS-3436G

TE Connectivity AMP Connectors

IDC CABLE - ADM34S/AE34G/ADM34S

0

A3DDB-6406G

A3DDB-6406G

TE Connectivity AMP Connectors

IDC CABLE- AKR64B/AE64G/AKR64B

0

A2MXS-2418M

A2MXS-2418M

TE Connectivity AMP Connectors

ADM24S/AE24M/X

0

2354173-1

2354173-1

TE Connectivity AMP Connectors

CA ELCON MICRO 2X8

79

A2MXS-2618M

A2MXS-2618M

TE Connectivity AMP Connectors

ADM26S/AE26M/X

0

A3DDH-4018G

A3DDH-4018G

TE Connectivity AMP Connectors

IDC CABLE - AKR40H/AE40G/AKR40H

0

A3CCB-6436G

A3CCB-6436G

TE Connectivity AMP Connectors

IDC CABLE- AKC64B/AE64G/AKC64B

0

A3AAH-5018M

A3AAH-5018M

TE Connectivity AMP Connectors

IDC CABLE - ASC50H/AE50M/ASC50H

0

A6MMS-1618G

A6MMS-1618G

TE Connectivity AMP Connectors

IDC CABLE - ADM16S/AE16G/ADM16S

0

A1DXH-1436M

A1DXH-1436M

TE Connectivity AMP Connectors

IDC CABLE - AKR14H/AE14M/X

0

2205068-2

2205068-2

TE Connectivity AMP Connectors

CABLE ASSEMBLY HEADER WTB 4POS

13

A1RXB-1036G

A1RXB-1036G

TE Connectivity AMP Connectors

IDC CABLE - APR10B/AE10G/X

0

A3KKB-3418M

A3KKB-3418M

TE Connectivity AMP Connectors

IDC CABLE - APK34B/AE34M/APK34B

0

A3RRB-5006M

A3RRB-5006M

TE Connectivity AMP Connectors

IDC CABLE - APR50B/AE50M/APR50B

0

A1BXB-2636M

A1BXB-2636M

TE Connectivity AMP Connectors

IDC CABLE- ASR26B/AE26M/X

0

A3CKB-1418G

A3CKB-1418G

TE Connectivity AMP Connectors

IDC CABLE - AKC14B/AE14G/APK14B

0

A1AXH-3036M

A1AXH-3036M

TE Connectivity AMP Connectors

IDC CABLE - ASC30H/AE30M/X

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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