Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
A3DDB-2618M

A3DDB-2618M

TE Connectivity AMP Connectors

IDC CABLE- AKR26B/AE26M/AKR26B

0

A3DDH-5036M

A3DDH-5036M

TE Connectivity AMP Connectors

IDC CABLE - AKR50H/AE50M/AKR50H

0

A3AKB-1606G

A3AKB-1606G

TE Connectivity AMP Connectors

IDC CABLE - ASC16B/AE16G/APK16B

0

A3DDH-1018G

A3DDH-1018G

TE Connectivity AMP Connectors

IDC CABLE - AKR10H/AE10G/AKR10H

0

A8MMS-1618G

A8MMS-1618G

TE Connectivity AMP Connectors

ADM16S/AE16G/ADM16S

0

A8MMS-1606M

A8MMS-1606M

TE Connectivity AMP Connectors

ADM16S/AE16M/ADM16S

0

A3BBH-1006G

A3BBH-1006G

TE Connectivity AMP Connectors

IDC CABLE - ASR10H/AE10G/ASR10H

0

1483352-3

1483352-3

TE Connectivity AMP Connectors

MICRO-MATCH LEAD 08P 250MM

2103

A1BXB-1036G

A1BXB-1036G

TE Connectivity AMP Connectors

IDC CABLE- ASR10B/AE10G/X

0

A3AAH-2418M

A3AAH-2418M

TE Connectivity AMP Connectors

IDC CABLE - ASC24H/AE24M/ASC24H

0

A6MMS-6436G

A6MMS-6436G

TE Connectivity AMP Connectors

IDC CABLE - ADM64S/AE64G/ADM64S

0

A1DXB-4436G

A1DXB-4436G

TE Connectivity AMP Connectors

IDC CABLE- AKR44B/AE50G/X

0

A3CCB-1606M

A3CCB-1606M

TE Connectivity AMP Connectors

IDC CABLE- AKC16B/AE16M/AKC16B

0

A1CXB-4436M

A1CXB-4436M

TE Connectivity AMP Connectors

IDC CABLE- AKC44B/AE50M/X

0

A3BBB-1418M

A3BBB-1418M

TE Connectivity AMP Connectors

IDC CABLE- ASR14B/AE14M/ASR14B

0

A3BBH-1436G

A3BBH-1436G

TE Connectivity AMP Connectors

IDC CABLE - ASR14H/AE14G/ASR14H

0

A1BXB-3436G

A1BXB-3436G

TE Connectivity AMP Connectors

IDC CABLE- ASR34B/AE34G/X

0

A3AKB-1636M

A3AKB-1636M

TE Connectivity AMP Connectors

IDC CABLE - ASC16B/AE16M/APK16B

0

A3CCH-6436M

A3CCH-6436M

TE Connectivity AMP Connectors

IDC CABLE - AKC64H/AE64M/AKC64H

0

A2MXS-2418G

A2MXS-2418G

TE Connectivity AMP Connectors

ADM24S/AE24G/X

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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