Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
A10SUR10SUR32W203A

A10SUR10SUR32W203A

JST

JUMPER 10SUR-32S - 10SUR-32S 8"

873

A14SUR14SUR32W203B

A14SUR14SUR32W203B

JST

JUMPER 14SUR-32S - 14SUR-32S 8"

0

A16XSR16XSR36R51A

A16XSR16XSR36R51A

JST

JUMPER 16XSR-36S - 16XSR-36S 2"

0

A16KR16KR26E254B

A16KR16KR26E254B

JST

JUMPER 16KR-6S-P - 16KR-6S-P 10"

995

A13SR13SR30K102B

A13SR13SR30K102B

JST

JUMPER 13SR-3S - 13SR-3S 4"

1000

A15KR15KR26E254A

A15KR15KR26E254A

JST

JUMPER 15KR-6S-P - 15KR-6S-P 10"

1000

A15SUR15SUR32W203A

A15SUR15SUR32W203A

JST

JUMPER 15SUR-32S - 15SUR-32S 8"

0

A14KR14KR26E305A

A14KR14KR26E305A

JST

JUMPER 14KR-6S-P - 14KR-6S-P 12"

563

A15KR15DA28W254B

A15KR15DA28W254B

JST

JUMPER 15DA-8M - 15KR-8M-P 10"

0

A20XAF20XAF22K203A

A20XAF20XAF22K203A

JST

JUMPER 20XAF-2S - 20XAF-2S 8"

1000

A09KR09DA28W203B

A09KR09DA28W203B

JST

JUMPER 09DA-8M - 09KR-8M-P 8"

0

A13KR13DA28W254B

A13KR13DA28W254B

JST

JUMPER 13DA-8M - 13KR-8M-P 10"

0

A10ZR10ZR28H102A

A10ZR10ZR28H102A

JST

JUMPER 10ZR-8M-P - 10ZR-8M-P 4"

951

A01RARSFP16K203B

A01RARSFP16K203B

JST

JUMPER RARSFP-1V-00 & RARSFC-1V

0

A13KR13KR26E51B

A13KR13KR26E51B

JST

JUMPER 13KR-6S-P - 13KR-6S-P 2"

1000

A02KR02KR26E254B

A02KR02KR26E254B

JST

JUMPER 02KR-6S-P - 02KR-6S-P 10"

511

A06XAF06XAF22K254B

A06XAF06XAF22K254B

JST

JUMPER 06XAF-2S - 06XAF-2S 10"

1049

A03XAF03XAF22K102A

A03XAF03XAF22K102A

JST

JUMPER 03XAF-2S - 03XAF-2S 4"

975

A07KR07KR26E51B

A07KR07KR26E51B

JST

JUMPER 07KR-6S-P - 07KR-6S-P 2"

974

A12SR12SR30K203A

A12SR12SR30K203A

JST

JUMPER 12SR-3S - 12SR-3S 8"

969

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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