Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
FI-RE41HL-KITASSY-300M

FI-RE41HL-KITASSY-300M

JAE Electronics

CABLE ASSY FI-RE 41POS 300MM

0

FI-S20S-KITASSY-300M

FI-S20S-KITASSY-300M

JAE Electronics

CABLE ASSY FI-S 20POS 300MM

0

FI-X30HL-KITASSY-300M

FI-X30HL-KITASSY-300M

JAE Electronics

CABLE ASSY FI-X 30POS 300MM

0

FI-RE51HL-KITASSY-300M

FI-RE51HL-KITASSY-300M

JAE Electronics

CABLE ASSY FI-RE 51POS 300MM

0

FI-S20S-2-L106

FI-S20S-2-L106

JAE Electronics

CONNECTEOR

0

FI-SE20S-2-L220

FI-SE20S-2-L220

JAE Electronics

CONNECTEOR

0

FI-SE20S-2-L100-AS

FI-SE20S-2-L100-AS

JAE Electronics

CONN RCPT 1.25MM 20POS SMD R/A

0

FI-S20S-2-L106-10

FI-S20S-2-L106-10

JAE Electronics

CONNECTEOR

0

FI-SE20HS-A-2000

FI-SE20HS-A-2000

JAE Electronics

CONNECTEOR

0

FI-SE20S-2-L200-AS

FI-SE20S-2-L200-AS

JAE Electronics

CONNECTEOR

0

FI-SE20S-2-L300S

FI-SE20S-2-L300S

JAE Electronics

CONNECTEOR

0

DEU-22726-300CM

DEU-22726-300CM

JAE Electronics

CONNECTEOR

0

FI-SE20HS-D-2000

FI-SE20HS-D-2000

JAE Electronics

CONNECTEOR

0

FI-SE20S-2-L150S

FI-SE20S-2-L150S

JAE Electronics

CONN RCPT 1.25MM 20POS SMD R/A

0

FI-SE20S-2-L400

FI-SE20S-2-L400

JAE Electronics

CONNECTEOR

0

DEU-22726-150CM

DEU-22726-150CM

JAE Electronics

CONNECTEOR

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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