Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
HIF612-60DT-AA-27.0HA(10)

HIF612-60DT-AA-27.0HA(10)

Hirose

CONN

0

HIF3BA-50D-A0-120.0KB

HIF3BA-50D-A0-120.0KB

Hirose

CONNECTOR

0

HIF612-100DT-AB10.0HA(71)

HIF612-100DT-AB10.0HA(71)

Hirose

CONNECTOR

0

HIF6H-60D-AB-100.0JJ

HIF6H-60D-AB-100.0JJ

Hirose

CONN

0

HIF6H-50D-AA-77.0HW

HIF6H-50D-AA-77.0HW

Hirose

CONN

0

WOGT17HSK(A)HNS(A)-0712

WOGT17HSK(A)HNS(A)-0712

Hirose

CONNECTOR

0

HIF6H-100D-AB-25.0JJ

HIF6H-100D-AB-25.0JJ

Hirose

CONN

0

HIF6-34D-AA-23.0HA

HIF6-34D-AA-23.0HA

Hirose

CONNECTOR

0

HIF612-60DT-AA-5.0HA(71)

HIF612-60DT-AA-5.0HA(71)

Hirose

CONNECTOR

0

RP34L-5PA-2SC(1857)(01)

RP34L-5PA-2SC(1857)(01)

Hirose

CONNECTOR

0

HIF6H-60D-AA-25.0JJ

HIF6H-60D-AA-25.0JJ

Hirose

CONN

0

HIF6-26D-AB-200.0HA

HIF6-26D-AB-200.0HA

Hirose

CONNECTOR

0

HIF6H-50D-AA-7.0JJ

HIF6H-50D-AA-7.0JJ

Hirose

CONN

0

HIF3BA-50D-AA-67.0KB

HIF3BA-50D-AA-67.0KB

Hirose

CONNECTOR

0

HIF6H-100D-AA-46.0JJ

HIF6H-100D-AA-46.0JJ

Hirose

CONNECTOR

0

HIF612-80DT-AA-30.0HA(10)

HIF612-80DT-AA-30.0HA(10)

Hirose

CONN

0

HIF6H-50D-AA-38.0JJ

HIF6H-50D-AA-38.0JJ

Hirose

CONNECTOR

0

HIF6H-100D-AB-28.0JJ

HIF6H-100D-AB-28.0JJ

Hirose

CONN

0

HIF3BA-20D-AC-60.0HA

HIF3BA-20D-AC-60.0HA

Hirose

CONNECTOR

0

HIF6-50D-AA-16.0KA

HIF6-50D-AA-16.0KA

Hirose

CONN

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
RFQ BOM Call Skype Email
Top