Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
G125-MC12605L4-0300F

G125-MC12605L4-0300F

Harwin

1.25MM M/F 26POS 26AWG 300MM

0

G125-MC12005L4-0150L

G125-MC12005L4-0150L

Harwin

1.25MM M/L 20POS 26AWG 150MM

5

M300-FC10605F2-0150L

M300-FC10605F2-0150L

Harwin

CBL ASS 3MM F 6POS DUAL 150MM

14

M55-8002042-0150A

M55-8002042-0150A

Harwin

CBL ASSEM 1.27MM 20POS F-F 150MM

63

G125-FC12005F1-0150F1

G125-FC12005F1-0150F1

Harwin

CBL GECKO 1.25MM F-F 150MM 20POS

17

G125-MC13405M1-0150F1

G125-MC13405M1-0150F1

Harwin

CBL GECKO 1.25MM M-F 150MM 34POS

8

G125-FC12005L0-0450L

G125-FC12005L0-0450L

Harwin

1.25MM F/L 20POS 26AWG 450MM

7

M50-9101042

M50-9101042

Harwin

CBL ASSY 1.27MM 20POS F-F 150MM

0

G125-FC12605L0-0450L

G125-FC12605L0-0450L

Harwin

1.25MM F/L 26POS 26AWG 450MM

31

M300-MC31005M1-0450L

M300-MC31005M1-0450L

Harwin

CBL ASS 3MM M 10POS DUAL 450MM

20

M300-FC11005F2-0300L

M300-FC11005F2-0300L

Harwin

CBL ASS 3MM F 10POS DUAL 300MM

4

M300-MC50305M1-0450L

M300-MC50305M1-0450L

Harwin

CBL ASS 3MM M 3POS SNGL 450MM

30

G125-F1MS110-075-L

G125-F1MS110-075-L

Harwin

FPC ASSY 1.25MM 10POS M CONN 75M

10

G125-FC12605F1-0150L

G125-FC12605F1-0150L

Harwin

CBL GECKO 1.25MM F 150MM 26POS

10

G125-MC11205M1-0150F1

G125-MC11205M1-0150F1

Harwin

CBL GECKO 1.25MM M-F 150MM 12POS

6

G125-FC11005F0-0450L

G125-FC11005F0-0450L

Harwin

CBL GECKO 1.25MM F 450MM 10POS

11

M80-FC305F1-08-0150F1

M80-FC305F1-08-0150F1

Harwin

CBL ASSEM RG178 F-F 150MM 8POS

10

G125-MC12005M1-0150F1

G125-MC12005M1-0150F1

Harwin

CBL GECKO 1.25MM M-F 150MM 20POS

101

M300-MC30605M1-0300L

M300-MC30605M1-0300L

Harwin

CBL ASS 3MM M 6POS DUAL 300MM

6

G125-MC12005M1-0150M1

G125-MC12005M1-0150M1

Harwin

CBL GECKO 1.25MM M-M 150MM 20POS

10

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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