Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
G125-MC25005L4-0150L

G125-MC25005L4-0150L

Harwin

1.25MM M/L 50POS 28AWG 150MM

0

G125-MC43405L0-0150M

G125-MC43405L0-0150M

Harwin

1.25MM M/M 34POS 32 AWG 150MM

0

G125-MC41205L4-0150L

G125-MC41205L4-0150L

Harwin

1.25MM M/L 12POS 32AWG 150MM

0

G125-MC41605L0-0300M

G125-MC41605L0-0300M

Harwin

1.25MM M/M 16POS 32 AWG 300MM

0

G125-FC21605L0-0450L

G125-FC21605L0-0450L

Harwin

1.25MM F/L 16POS 28AWG 450MM

0

G125-MC23405L4-0450L

G125-MC23405L4-0450L

Harwin

1.25MM M/L 34POS 28AWG 450MM

0

G125-FC25005L0-0300F

G125-FC25005L0-0300F

Harwin

1.25MM F/F 50POS 28AWG 300MM

0

G125-MC31005L4-0450L

G125-MC31005L4-0450L

Harwin

1.25MM M/L 10POS 30AWG 450MM

0

G125-FC33405L0-0150F

G125-FC33405L0-0150F

Harwin

1.25MM F/F 34POS 30AWG 150MM

0

G125-FC13405F0-0150L

G125-FC13405F0-0150L

Harwin

CBL GECKO 1.25MM F 150MM 34POS

0

G125-MC22005L4-0450L

G125-MC22005L4-0450L

Harwin

1.25MM M/L 20POS 28AWG 450MM

0

G125-MC30605L0-0150L

G125-MC30605L0-0150L

Harwin

1.25MM M/L 6POS 30 AWG 150MM

0

G125-MC10605M1-0300F0

G125-MC10605M1-0300F0

Harwin

CBL GECKO 1.25MM M-F 300MM 6POS

0

G125-MC35005L0-0300F

G125-MC35005L0-0300F

Harwin

1.25MM M/F 50POS 30 AWG 300MM

0

G125-FC30605L0-0300F

G125-FC30605L0-0300F

Harwin

1.25MM F/F 6POS 30AWG 300MM

0

G125-FC30605L0-0150F

G125-FC30605L0-0150F

Harwin

1.25MM F/F 6POS 30AWG 150MM

0

G125-FC35005L0-0150L

G125-FC35005L0-0150L

Harwin

1.25MM F/L 50POS 30AWG 150MM

0

G125-MC43405L0-0150L

G125-MC43405L0-0150L

Harwin

G125-MC43405L0-0150L

0

G125-MC31005L0-0450L

G125-MC31005L0-0450L

Harwin

G125-MC31005L0-0450L

0

G125-FC32005L0-0150L

G125-FC32005L0-0150L

Harwin

1.25MM F/L 20POS 30AWG 150MM

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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