Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
M55-8008042-0300A

M55-8008042-0300A

Harwin

CBL ASSEM 1.27MM 80POS F-F 300MM

15

G125-MC15005M1-0150M1

G125-MC15005M1-0150M1

Harwin

CBL GECKO 1.25MM M-M 150MM 50POS

10

M80-FC305F1-04-0300F1

M80-FC305F1-04-0300F1

Harwin

CBL ASSEM RG178 F-F 300MM 4POS

8

M50-9102042

M50-9102042

Harwin

CBL ASSY 1.27MM 40POS F-F 150MM

160

M50-9011342

M50-9011342

Harwin

IDC F/M 13POS RIBBON CBL ASSY

21

M300-MC11005M1-0300L

M300-MC11005M1-0300L

Harwin

CBL ASS 3MM M 10POS DUAL 300MM

3

M55-8006842-0150A

M55-8006842-0150A

Harwin

CBL ASSEM 1.27MM 68POS F-F 150MM

30

G125-MC12005L4-0450L

G125-MC12005L4-0450L

Harwin

1.25MM M/L 20POS 26AWG 450MM

22

G125-MC11205M1-0300M1

G125-MC11205M1-0300M1

Harwin

CBL GECKO 1.25MM M-M 300MM 12POS

9

M300-FC20605F2-0450L

M300-FC20605F2-0450L

Harwin

CBL ASS 3MM F 6POS DUAL 450MM

19

G125-MC12605M1-0150F1

G125-MC12605M1-0150F1

Harwin

CBL GECKO 1.25MM M-F 150MM 26POS

4

M80-FC305F1-06-0450L

M80-FC305F1-06-0450L

Harwin

CBL ASS RG178 FMALE 450MM 6POS

7

M55-8005042-0150A

M55-8005042-0150A

Harwin

CBL ASSEM 1.27MM 50POS F-F 150MM

51

G125-MC10605M1-0150M1

G125-MC10605M1-0150M1

Harwin

CBL GECKO 1.25MM M-M 150MM 6POS

10

G125-MC12605L4-0450L

G125-MC12605L4-0450L

Harwin

1.25MM M/L 26POS 26AWG 450MM

11

G125-FC11005F1-0450L

G125-FC11005F1-0450L

Harwin

CBL GECKO 1.25MM F 450MM 10POS

56

G125-FC12005F1-0300F1

G125-FC12005F1-0300F1

Harwin

CBL GECKO 1.25MM F-F 300MM 20POS

27

G125-FC12605L0-0300F

G125-FC12605L0-0300F

Harwin

1.25MM F/F 26POS 26AWG 300MM

26

G125-MC12005L4-0150M

G125-MC12005L4-0150M

Harwin

1.25MM M/M 20POS 26AWG 150MM

22

G125-FC11205F1-0150F1

G125-FC11205F1-0150F1

Harwin

CBL GECKO 1.25MM F-F 150MM 12POS

9

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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