Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
MF410C3M0MF4

MF410C3M0MF4

GlobTek, Inc.

3 METER 4 CONDUCTOR WITH MOLEX C

221

MF1010C1M0MF10

MF1010C1M0MF10

GlobTek, Inc.

1M CORD, 10C WITH MOLEX 43025-10

139

ML424642M1TTT(R)

ML424642M1TTT(R)

GlobTek, Inc.

CABLE WITH MOLEDED MOLEX 43025-0

20

OSP-431-01000018(R)

OSP-431-01000018(R)

GlobTek, Inc.

CABLE ASSY, MOLEX 43025-0200 & T

0

XHP410070M7MLX3(R)

XHP410070M7MLX3(R)

GlobTek, Inc.

JST XHP-4 2.54MM 4 CIRCUIT CONNE

69

MLX410070M23MLX2X2(R

MLX410070M23MLX2X2(R

GlobTek, Inc.

MOLEX HOUSING 2.54MM PITCH 4 CIR

50

ML224641M0ML2(R)

ML224641M0ML2(R)

GlobTek, Inc.

2 POSITION MOLEX 39-01-2025 MINI

93

PHX19121840M3PHX1912184

PHX19121840M3PHX1912184

GlobTek, Inc.

KFZEDGM-X-5. 08-ZP-LG, EQUAL TO

20

MLX2SILI180M35TT

MLX2SILI180M35TT

GlobTek, Inc.

MOLEX MICRO-FIT 3.0 RCPT HOUSING

20

MF610C3M0MF6

MF610C3M0MF6

GlobTek, Inc.

3 METER 6 CONDUCTOR MOLEX CONNEC

78

MF243645UL24641MMF24365(R)

MF243645UL24641MMF24365(R)

GlobTek, Inc.

MOLEX 43645-0200 OR EQUIV WITH 4

85

MF1010C3M0MF10

MF1010C3M0MF10

GlobTek, Inc.

3M CORD, 10C WITH MOLEX 43025-10

94

MF410C1M0MF4

MF410C1M0MF4

GlobTek, Inc.

CORDSET WITH MOLDED MOLEX CONNEC

977

XHP410070M7XHP4(R)

XHP410070M7XHP4(R)

GlobTek, Inc.

JST XHP-4 2.54MM 4 CIRCUIT CONNE

973

MLX3410070M7MLX3(R)

MLX3410070M7MLX3(R)

GlobTek, Inc.

MOLEX HOUSING 09-93-0300 WITH TE

99

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
RFQ BOM Call Skype Email
Top