Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
2153281021

2153281021

Woodhead - Molex

MINIFIT JR DR P-S 2 CIRCUIT 150M

0

2153232022

2153232022

Woodhead - Molex

MINIFIT JR SR M-S 2 CIRCUIT 300M

100

0923150828

0923150828

Woodhead - Molex

8CKT PICOFLEX 280MM LONG

0

2153261101

2153261101

Woodhead - Molex

MINIFIT JR DR R-S 10 CIRCUIT 150

0

2153261042

2153261042

Woodhead - Molex

MINIFIT JR DR R-S 4 CIRCUIT 300M

0

0151350603

0151350603

Woodhead - Molex

CLICKMATE 6 CIRCUIT 300MM

0

0151370600

0151370600

Woodhead - Molex

MINI-LOCK-TO-MINI-LOCK OFF-THE-S

15

0151350601

0151350601

Woodhead - Molex

CLICKMATE 6 CIRCUIT 100MM

0

0369240403

0369240403

Woodhead - Molex

MINIFIT-SR 4 CIRCUIT 300MM

100

0151320602

0151320602

Woodhead - Molex

CABLE ASSY PICOLOCK 6 POS 150MM

1222

0923151604

0923151604

Woodhead - Molex

16CKT PICOFLEX 1150MM LONG

0

2162701083

2162701083

Woodhead - Molex

SL POSITIVE LOCK R-R 8CKT 300MM

0

0923150805

0923150805

Woodhead - Molex

8CKT PICOFLEX 1200MM LONG

0

0151360501

0151360501

Woodhead - Molex

MICROCLASP 5 CIRCUIT 100MM

0

2163301024

2163301024

Woodhead - Molex

EDGE LOCK R-R 2CKT 600MM SN

0

2162811023

2162811023

Woodhead - Molex

MX150 R-S SR 2CKT 600MM SN SEALE

0

0369200602

0369200602

Woodhead - Molex

PICOEZMATE 6 CIRCUIT 150MM

330

0151370506

0151370506

Woodhead - Molex

MINI-LOCK-TO-MINI-LOCK OFF-THE-S

17

0151330703

0151330703

Woodhead - Molex

PICO-CLASP 7 CIRCUIT 300MM

632

2153281102

2153281102

Woodhead - Molex

MINIFIT JR DR P-S 10 CIRCUIT 300

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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