Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
0151350203

0151350203

Woodhead - Molex

CLICKMATE 2 CIRCUIT 300MM

1461

0369200505

0369200505

Woodhead - Molex

PICOEZMATE 5 CIRCUIT 450MM

168

2451320605

2451320605

Woodhead - Molex

MICROFIT 6 CIRCUIT BLACK 500MM O

746

2162931061

2162931061

Woodhead - Molex

STANDARD .093 6 CIRCUIT P TO S 1

0

2147552021

2147552021

Woodhead - Molex

MICRO-FIT3.0 R-R 2 CIRCUIT 150MM

0

2162821022

2162821022

Woodhead - Molex

MX150 P-P SR 2CKT 300MM SN SEALE

0

0451110606

0451110606

Woodhead - Molex

MICROLOCK PLUS CABLE BLACK 6 CKT

226

1451350301

1451350301

Woodhead - Molex

MINI-FIT 3 CIRCUIT 150MM

96

2162931022

2162931022

Woodhead - Molex

STANDARD .093 2 CIRCUIT P TO S 3

0

0151340706

0151340706

Woodhead - Molex

PICOBLADE 7 CIRCUIT 600MM

0

2153232053

2153232053

Woodhead - Molex

MINIFIT JR SR M-S 5 CIRCUIT 600M

50

0923212640

0923212640

Woodhead - Molex

26CCT QF50 RIBBON CABLE ASSY

1

2166201023

2166201023

Woodhead - Molex

SQUBA 3.6 R-R 2CKT 600MM SN

0

0151350403

0151350403

Woodhead - Molex

CLICKMATE 4 CIRCUIT 300MM

2290

2153211042

2153211042

Woodhead - Molex

MINIFIT JR SR R-S 4 CIRCUIT 300M

75

0923151210

0923151210

Woodhead - Molex

12CC PICOFLEX 100MM LONG

2462

0151360806

0151360806

Woodhead - Molex

MICROCLASP 8 CIRCUIT 600MM

884

1451350310

1451350310

Woodhead - Molex

MINI-FIT 3 CIRCUIT 1M

64

0923150632

0923150632

Woodhead - Molex

6CKT PICOFLEX 320MM LONG

0

0923151032

0923151032

Woodhead - Molex

10CKT PICOFLEX 320MM LONG

2600

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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