Rectangular Cable Assemblies

Part Number	Description / PDF	Quantity
0151340403 Woodhead - Molex	PICOBLADE 4 CIRCUIT 300MM	0
2163311044 Woodhead - Molex	EDGE LOCK R-S 4CKT 600MM SN	0
2160111023 Woodhead - Molex	SUPER SABER RS 600MM 2CKT SN	0
0923161010 Woodhead - Molex	10CC PICOFLEX 100MM LONG	0
2147551021 Woodhead - Molex	MICRO-FIT3.0 R-R 2 CIRCUIT 150MM	0
2153201022 Woodhead - Molex	MINIFIT JR SR R-R 2 CIRCUIT 300M	500
0451301010 Woodhead - Molex	NANO-FIT 10 CIRCUIT 1M	554
0451320801 Woodhead - Molex	MICROFIT 8 CIRCUIT 150MM	827
2162861063 Woodhead - Molex	MX150 R-S DR 6CKT 600MM SN SEALE	0
2147572102 Woodhead - Molex	MICRO-FIT3.0 P-P 10 CIRCUIT 300M	0
2166211023 Woodhead - Molex	SQUBA 3.6 R-S 2CKT 600MM SN	0
2162801021 Woodhead - Molex	MX150 R-R SR 2CKT 150MM SN SEALE	0
2451361020 Woodhead - Molex	MEGAFIT 10CKT BLACK 2M OVERMOLDE	98
0151320400 Woodhead - Molex	CABLE ASSY PICOLOCK 4 POS 50MM	1733
0151341203 Woodhead - Molex	PICOBLADE 12 CIRCUIT 300MM	121
1451350610 Woodhead - Molex	MINI-FIT 6 CIRCUIT 1M	90
2451360420 Woodhead - Molex	MEGAFIT 4 CIRCUIT BLACK 2M OVERM	393
2162711022 Woodhead - Molex	SL POSITIVE LOCK R-S 2CKT 150MM	0
2162721083 Woodhead - Molex	SL POSITIVE LOCK P-P 8CKT 300MM	0
2153282041 Woodhead - Molex	MINIFIT JR DR P-S 4 CIRCUIT 150M	0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
D-Subminiature	Metal-shielded, screw-locking design	Industrial computers, military equipment
IDC (Insulation Displacement)	Tool-less termination, flat cable compatibility	Telecom switches, HVAC systems
Board-to-Board	Low-profile, high-pin-count options	Servers, medical imaging devices
Ribbon Cable	Parallel signal routing, flexible dielectric	Computer peripherals, test equipment

3. Structure and Components

Typical construction includes:

Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
Shielding: Braided copper or conductive polymer layers
Strain relief: Molded thermoplastic overbraiding
Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

Parameter	Typical Range	Importance
Rated Voltage	50V - 600V	Ensures dielectric safety
Current Capacity	1A - 15A per contact	Determines power handling
Contact Resistance	5-20m	Impacts signal integrity
Insulation Resistance	100M - 10G	Prevents leakage currents
Operating Temperature	-55 C to +125 C	Environmental reliability
Mating Cycles	500 - 5000 cycles	Durability indicator

5. Application Fields

Primary sectors include:

Computer & Peripherals: Server backplanes, GPU interconnects
Telecommunications: 5G base stations, optical network terminals
Industrial Automation: PLC interfaces, robotic controllers
Medical Equipment: MRI scanners, diagnostic devices
Transportation: EV battery management systems, avionics

6. Leading Manufacturers

Manufacturer	Key Products
Amphenol Corporation	D-Sub 90 PCB Mount Series
TE Connectivity	MATE-AX High-Speed Backplane Cables
Molex LLC	PicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.	QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

Electrical requirements (voltage/current profiles)
Mechanical constraints (space limitations, vibration exposure)
Environmental factors (temperature extremes, chemical exposure)
Signal integrity needs (impedance control, crosstalk reduction)
Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

Miniaturization: 0.4mm pitch connectors for mobile devices
High-speed capabilities: 25+ Gbps differential pair designs
Smart integration: Embedded sensors for condition monitoring
Sustainability focus: Halogen-free materials adoption
Automated manufacturing: AI-driven quality control systems