Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
C0RRG-2436M

C0RRG-2436M

CW Industries

DIP CABLE - CDR24G/AE24M/CDR24G

0

C3AAG-6036G

C3AAG-6036G

CW Industries

IDC CABLE - CSC60G/AE60G/CSC60G

0

C1AXS-1636M

C1AXS-1636M

CW Industries

IDC CABLE - CSC16S/AE16M/X

0

C1DXS-2036G

C1DXS-2036G

CW Industries

IDC CABLE - CKR20S/AE20G/X

0

C2PXS-4036G

C2PXS-4036G

CW Industries

DIP CABLE - CDP40S/AE40G/X

0

C3EEG-5036M

C3EEG-5036M

CW Industries

IDC CABLE - CCE50G/AE50M/CCE50G

0

C3AEG-2036G

C3AEG-2036G

CW Industries

IDC CABLE - CSC20G/AE20G/CCE20G

0

C6RRS-2406G

C6RRS-2406G

CW Industries

DIP CABLE - CDR24S/AE24G/CDR24S

0

C3CCG-2006G

C3CCG-2006G

CW Industries

IDC CABLE - CKC20G/AE20G/CKC20G

0

C4PXS-1418M

C4PXS-1418M

CW Industries

DIP CABLE - CDP14S/AE14M/X

0

C4PXG-2436M

C4PXG-2436M

CW Industries

DIP CABLE - CDP24G/AE24M/X

0

C3DPS-3406G

C3DPS-3406G

CW Industries

IDC CABLE - CKR34S/AE34G/CPC34S

0

C3CCS-5018M

C3CCS-5018M

CW Industries

IDC CABLE - CKC50S/AE50M/CKC50S

0

C3AEG-5006G

C3AEG-5006G

CW Industries

IDC CABLE - CSC50G/AE50G/CCE50G

0

C4PXG-4006M

C4PXG-4006M

CW Industries

DIP CABLE - CDP40G/AE40M/X

0

C3CCS-2006G

C3CCS-2006G

CW Industries

IDC CABLE - CKC20S/AE20G/CKC20S

0

C1PXS-2036M

C1PXS-2036M

CW Industries

IDC CABLE - CPC20S/AE20M/X

0

C3BPS-1018G

C3BPS-1018G

CW Industries

IDC CABLE - CSR10S/AE10G/CPC10S

0

C1DXS-1036M

C1DXS-1036M

CW Industries

IDC CABLE - CKR10S/AE10M/X

0

C8RRG-4018G

C8RRG-4018G

CW Industries

DIP CABLE - CDR40G/AE40G/CDR40G

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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