Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
C1CXG-5036M

C1CXG-5036M

CW Industries

IDC CABLE - CKC50G/AE50M/X

0

C3BBG-4018M

C3BBG-4018M

CW Industries

IDC CABLE - CSR40G/AE40M/CSR40G

0

C1AXS-1636G

C1AXS-1636G

CW Industries

IDC CABLE - CSC16S/AE16G/X

0

C1AXS-1036G

C1AXS-1036G

CW Industries

IDC CABLE - CSC10S/AE10G/X

0

C1BXG-3436G

C1BXG-3436G

CW Industries

IDC CABLE - CSR34G/AE34G/X

0

C3BBG-1406M

C3BBG-1406M

CW Industries

IDC CABLE - CSR14G/AE14M/CSR14G

0

C8PPS-1436M

C8PPS-1436M

CW Industries

DIP CABLE - CDP14S/AE14M/CDP14S

0

C8PPS-2418G

C8PPS-2418G

CW Industries

DIP CABLE - CDP24S/AE24G/CDP24S

0

C3EES-2636M

C3EES-2636M

CW Industries

IDC CABLE - CCE26S/AE26M/CCE26S

0

C3BBS-1018G

C3BBS-1018G

CW Industries

IDC CABLE - CSR10S/AE10G/CSR10S

0

C0PPS-4036M

C0PPS-4036M

CW Industries

DIP CABLE - CDP40S/AE40M/CDP40S

0

C3BBG-5036M

C3BBG-5036M

CW Industries

IDC CABLE - CSR50G/AE50M/CSR50G

0

C3PPS-4006G

C3PPS-4006G

CW Industries

IDC CABLE - CPC40S/AE40G/CPC40S

4

C3AAS-5018G

C3AAS-5018G

CW Industries

IDC CABLE - CSC50S/AE50G/CSC50S

0

C3DEG-3418M

C3DEG-3418M

CW Industries

IDC CABLE - CKR34G/AE34M/CCE34G

0

C2PXG-2418M

C2PXG-2418M

CW Industries

DIP CABLE - CDP24G/AE24M/X

0

C1AXS-1436M

C1AXS-1436M

CW Industries

IDC CABLE - CSC14S/AE14M/X

0

C2RXG-1618G

C2RXG-1618G

CW Industries

DIP CABLE - CDP16G/AE16G/X

0

C0PPG-2418M

C0PPG-2418M

CW Industries

DIP CABLE - CDP24G/AE24M/CDP24G

0

C3CCS-5036M

C3CCS-5036M

CW Industries

IDC CABLE - CKC50S/AE50M/CKC50S

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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