Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
C3EEG-2636M

C3EEG-2636M

CW Industries

IDC CABLE - CCE26G/AE26M/CCE26G

0

C3BBS-6036M

C3BBS-6036M

CW Industries

IDC CABLE - CSR60S/AE60M/CSR60S

0

C8PPS-2406G

C8PPS-2406G

CW Industries

DIP CABLE - CDP24S/AE24G/CDP24S

0

C3PPS-2006G

C3PPS-2006G

CW Industries

IDC CABLE - CPC20S/AE20G/CPC20S

43

C1CXS-2036M

C1CXS-2036M

CW Industries

IDC CABLE - CKC20S/AE20M/X

0

C1CXS-1436M

C1CXS-1436M

CW Industries

IDC CABLE - CKC14S/AE14M/X

0

C3BBS-5006G

C3BBS-5006G

CW Industries

IDC CABLE - CSR50S/AE50G/CSR50S

0

C1EXS-1036M

C1EXS-1036M

CW Industries

IDC CABLE - CCE10S/AE10M/X

0

C3BBS-2636G

C3BBS-2636G

CW Industries

IDC CABLE - CSR26S/AE26G/CSR26S

0

C6RRG-2418G

C6RRG-2418G

CW Industries

DIP CABLE - CDR24G/AE24G/CDR24G

0

C8RRS-4036M

C8RRS-4036M

CW Industries

DIP CABLE - CDR40S/AE40M/CDR40S

0

C8PPG-4036G

C8PPG-4036G

CW Industries

DIP CABLE - CDP40G/AE40G/CDP40G

0

C3BBG-5018M

C3BBG-5018M

CW Industries

IDC CABLE - CSR50G/AE50M/CSR50G

0

C3BES-2036G

C3BES-2036G

CW Industries

IDC CABLE - CSR20S/AE20G/CCE20S

0

C3AAS-5006M

C3AAS-5006M

CW Industries

IDC CABLE - CSC50S/AE50M/CSC50S

0

C8RRG-4006M

C8RRG-4006M

CW Industries

DIP CABLE - CDR40G/AE40M/CDR40G

0

C6RRS-1636G

C6RRS-1636G

CW Industries

DIP CABLE - CDR16S/AE16G/CDR16S

0

C3AAG-1606G

C3AAG-1606G

CW Industries

IDC CABLE - CSC16G/AE16G/CSC16G

0

C3BBG-2006G

C3BBG-2006G

CW Industries

IDC CABLE - CSR20G/AE20G/CSR20G

0

C6RRG-2418M

C6RRG-2418M

CW Industries

DIP CABLE - CDR24G/AE24M/CDR24G

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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