Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
L3KKH-1606C

L3KKH-1606C

CnC Tech

IDC CBL - LPK16H/CN225MC/LPK16H

0

L3CCH-1406C

L3CCH-1406C

CnC Tech

IDC CBL - LKC14H/CN224MC/LKC14H

0

L3CCH-1018C

L3CCH-1018C

CnC Tech

IDC CBL - LKC10H/CN223MC/LKC10H

0

L3DKH-2606N

L3DKH-2606N

CnC Tech

IDC CBL - LKR26H/CN221GR/LPK26H

0

L3DKH-1006N

L3DKH-1006N

CnC Tech

IDC CBL - LKR10H/CN217GR/LPK10H

0

L3KKH-2006N

L3KKH-2006N

CnC Tech

IDC CBL - LPK20H/CN220GR/LPK20H

0

L3DKH-1018C

L3DKH-1018C

CnC Tech

IDC CBL - LKR10H/CN223MC/LPK10H

0

L3CCH-1018N

L3CCH-1018N

CnC Tech

IDC CBL - LKC10H/CN217GR/LKC10H

0

355-28-18-GR-00012

355-28-18-GR-00012

CnC Tech

CABLE ASSY DIP IDC 12POS 12"

497

L3KKH-1618N

L3KKH-1618N

CnC Tech

IDC CBL - LPK16H/CN219GR/LPK16H

0

L3CKH-2618N

L3CKH-2618N

CnC Tech

IDC CBL - LKC26H/CN221GR/LPK26H

0

L3KKH-1406N

L3KKH-1406N

CnC Tech

IDC CBL - LPK14H/CN218GR/LPK14H

0

L3KKH-4036C

L3KKH-4036C

CnC Tech

IDC CBL - LPK40H/CN228MC/LPK40H

0

810-10095-00020

810-10095-00020

CnC Tech

INTERNAL Y-POWER CABLE

0

355-28-10-GR-00018

355-28-10-GR-00018

CnC Tech

CABLE ASSY DIP IDC 10POS 18"

0

355-28-18-GR-00018

355-28-18-GR-00018

CnC Tech

CABLE ASSY DIP IDC 18POS 18"

0

355-28-06-GR-00018

355-28-06-GR-00018

CnC Tech

CABLE ASSY DIP IDC 6POS 18"

0

355-28-12-GR-00018

355-28-12-GR-00018

CnC Tech

CABLE ASSY DIP IDC 12POS 18"

0

355-28-04-GR-00018

355-28-04-GR-00018

CnC Tech

CABLE ASSY DIP IDC 4POS 18"

0

355-28-26-GR-00018

355-28-26-GR-00018

CnC Tech

CABLE ASSY DIP IDC 26POS 18"

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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