Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
MJSU-10SH3

MJSU-10SH3

VEAM

MICRO

0

MJSB-66SH003

MJSB-66SH003

VEAM

MICRO

0

MTB1-2SH001

MTB1-2SH001

VEAM

MICRO

0

MTV1-11SH003-04

MTV1-11SH003-04

VEAM

MICRO

0

MTV1-4SH32

MTV1-4SH32

VEAM

MICRO

0

MTB1-6SH8

MTB1-6SH8

VEAM

MICRO

0

MTV1-3PH046

MTV1-3PH046

VEAM

MICRO

0

MJSV-16SH003

MJSV-16SH003

VEAM

MICRO

0

MTB1-14SH048-1

MTB1-14SH048-1

VEAM

MICRO

0

MJSB-10PH001

MJSB-10PH001

VEAM

MICRO

0

MTV2-9SH1

MTV2-9SH1

VEAM

MICRO

0

MJSV-23SH1

MJSV-23SH1

VEAM

MICRO

0

MTB1-4PH003-3

MTB1-4PH003-3

VEAM

MICRO

0

NTP1-5SH008

NTP1-5SH008

VEAM

MICRO

0

MTV1-29SH003-04

MTV1-29SH003-04

VEAM

MICRO

0

MTB1-4PH004

MTB1-4PH004

VEAM

MICRO

0

MTV1-15PH003-04

MTV1-15PH003-04

VEAM

MICRO

0

MTB1-13PH2

MTB1-13PH2

VEAM

MICRO

0

MJSB-51SH034

MJSB-51SH034

VEAM

MICRO

0

MTV1-77SH3

MTV1-77SH3

VEAM

MICRO

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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