Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
M3GGK-2006R

M3GGK-2006R

3M

IDC CABLE - MCS20K/MC20M/MCS20K

0

M1BXA-5036J

M1BXA-5036J

3M

IDC CABLE - MSR50A/MC50G/X

0

M3AKK-2006J

M3AKK-2006J

3M

IDC CABLE - MSC20K/MC20G/MPK20K

0

M3AAK-2640K

M3AAK-2640K

3M

IDC CABLE - MSC26K/MC26F/MSC26K

0

M3CEK-4060K

M3CEK-4060K

3M

IDC CABLE - MKC40K/MC40F/MCE40K

0

M3DYK-3006J

M3DYK-3006J

3M

IDC CABLE - MKR30K/MC34G/MPD30K

0

M3BMK-1640K

M3BMK-1640K

3M

IDC CABLE - MSR16K/MC16F/MCG16K

0

M3DDA-2020K

M3DDA-2020K

3M

IDC CABLE - MKR20A/MC20F/MKR20A

0

M3UGK-3436J

M3UGK-3436J

3M

IDC CABLE - MKS34K/MC34G/MCS34K

0

M3UUK-4018J

M3UUK-4018J

3M

IDC CABLE - MKS40K/MC40G/MKS40K

0

45120-010030-3749/20-S-6

45120-010030-3749/20-S-6

3M

SGL END CBL ASSY 20POS SKT 6"

7

M3GGK-2040K

M3GGK-2040K

3M

IDC CABLE - MCS20K/MC20F/MCS20K

0

45116-010030-3749/16-D-6

45116-010030-3749/16-D-6

3M

DBL END CBL ASY 16POS SKT 6"

0

M3CCK-1036J

M3CCK-1036J

3M

IDC CABLE - MKC10K/MC10G/MKC10K

0

M3GGK-1640K

M3GGK-1640K

3M

IDC CABLE - MCS16K/MC16F/MCS16K

0

M1WXK-4040K

M1WXK-4040K

3M

IDC CABLE - MPL40K/MC40F/X

0

M3BEK-2040K

M3BEK-2040K

3M

IDC CABLE - MSR20K/MC20F/MCE20K

0

M3KKK-2636J

M3KKK-2636J

3M

IDC CABLE - MPK26K/MC26G/MPK26K

0

M3TEK-5036R

M3TEK-5036R

3M

IDC CABLE - MSD50K/MC50M/MCE50K

0

M3BFK-2018R

M3BFK-2018R

3M

IDC CABLE - MSR20K/MC20M/MCF20K

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
RFQ BOM Call Skype Email
Top