Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
M1RXK-4040K

M1RXK-4040K

3M

IDC CABLE - MPR40K/MC40F/X

0

M3FFK-1660K

M3FFK-1660K

3M

IDC CABLE - MCF16K/MC16F/MCF16K

0

M1CXA-3436J

M1CXA-3436J

3M

IDC CABLE - MKC34A/MC34G/X

9

M3BBK-1006J

M3BBK-1006J

3M

IDC CABLE - MSR10K/MC10G/MSR10K

0

M3UFK-2606J

M3UFK-2606J

3M

IDC CABLE - MKS26K/MC26G/MCF26K

0

M3UEK-1036J

M3UEK-1036J

3M

IDC CABLE - MKS10K/MC10G/MCE10K

0

M3CCK-5040K

M3CCK-5040K

3M

IDC CABLE - MKC50K/MC50F/MKC50K

0

M3BBA-1060K

M3BBA-1060K

3M

IDC CABLE - MSR10A/MC10F/MSR10A

0

M3BFK-2636J

M3BFK-2636J

3M

IDC CABLE - MSR26K/MC26G/MCF26K

0

M3BEK-1036J

M3BEK-1036J

3M

IDC CABLE - MSR10K/MC10G/MCE10K

0

M1WXK-2036J

M1WXK-2036J

3M

IDC CABLE - MPL20K/MC20G/X

0

M1MXK-2636J

M1MXK-2636J

3M

IDC CABLE - MCG26K/MC26G/X

0

M3DGK-1606J

M3DGK-1606J

3M

IDC CABLE - MKR16K/MC16G/MCS16K

0

M3TMK-4036R

M3TMK-4036R

3M

IDC CABLE - MSD40K/MC40M/MCG40K

0

M3AAK-2018R

M3AAK-2018R

3M

IDC CABLE - MSC20K/MC20M/MSC20K

0

M3DYK-6036R

M3DYK-6036R

3M

IDC CABLE - MKR60K/MC60M/MPD60K

0

M3DDA-1418J

M3DDA-1418J

3M

IDC CABLE - MKR14A/MC14G/MKR14A

0

M3BMK-1006J

M3BMK-1006J

3M

IDC CABLE - MSR10K/MC10G/MCG10K

0

M3BFK-6060K

M3BFK-6060K

3M

IDC CABLE - MSR60K/MC60F/MCF60K

0

M3DYK-4040K

M3DYK-4040K

3M

IDC CABLE - MKR40K/MC40F/MPD40K

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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