Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
M3TTK-3006J

M3TTK-3006J

3M

IDC CABLE - MSD30K/MC34G/MSD30K

0

M3BGK-2660K

M3BGK-2660K

3M

IDC CABLE - MSR26K/MC26F/MCS26K

0

M3AKK-3018R

M3AKK-3018R

3M

IDC CABLE - MSC30K/MC34M/MPK30K

0

M3BBA-1606J

M3BBA-1606J

3M

IDC CABLE - MSR16A/MC16G/MSR16A

0

M3TMK-1006J

M3TMK-1006J

3M

IDC CABLE - MSD10K/MC10G/MCG10K

0

M3AFK-2606J

M3AFK-2606J

3M

IDC CABLE - MSC26K/MC26G/MCF26K

0

M3BBK-1436R

M3BBK-1436R

3M

IDC CABLE - MSR14K/MC14M/MSR14K

0

M3TGK-2040K

M3TGK-2040K

3M

IDC CABLE - MSD20K/MC20F/MCS20K

0

M3EEK-6436R

M3EEK-6436R

3M

IDC CABLE - MCE64K/MC64M/MCE64K

0

M3BMK-1660K

M3BMK-1660K

3M

IDC CABLE - MSR16K/MC16F/MCG16K

0

M3BGK-2006J

M3BGK-2006J

3M

IDC CABLE - MSR20K/MC20G/MCS20K

0

M3BYK-2418J

M3BYK-2418J

3M

IDC CABLE - MSR24K/MC24G/MPD24K

0

45130-010030-7700/30-F-24

45130-010030-7700/30-F-24

3M

CABLE ASSY 30 POS 24" PINOUT-F

0

M1YXK-2636R

M1YXK-2636R

3M

IDC CABLE - MPD26K/MC26M/X

0

M3AFK-4036J

M3AFK-4036J

3M

IDC CABLE - MSC40K/MC40G/MCF40K

0

45120-010030-7700/20-F-36

45120-010030-7700/20-F-36

3M

CABLE ASSY 20 POS 36" PINOUT-F

0

M3KKK-2618J

M3KKK-2618J

3M

IDC CABLE - MPK26K/MC26G/MPK26K

0

M3MMK-4036J

M3MMK-4036J

3M

IDC CABLE - MCG40K/MC40G/MCG40K

0

M3DYK-5036J

M3DYK-5036J

3M

IDC CABLE - MKR50K/MC50G/MPD50K

0

M3UMK-5018J

M3UMK-5018J

3M

IDC CABLE - MKS50K/MC50G/MCG50K

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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