Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
M3BBK-3006R

M3BBK-3006R

3M

IDC CABLE - MSR30K/MC34M/MSR30K

0

M3CFK-4018R

M3CFK-4018R

3M

IDC CABLE - MKC40K/MC40M/MCF40K

0

45120-010030-7700/20-B-12

45120-010030-7700/20-B-12

3M

CABLE ASSY 20 POS 12" PINOUT-B

0

M3TFK-5036R

M3TFK-5036R

3M

IDC CABLE - MSD50K/MC50M/MCF50K

0

M3CFK-1660K

M3CFK-1660K

3M

IDC CABLE - MKC16K/MC16F/MCF16K

0

M1UXK-2436R

M1UXK-2436R

3M

IDC CABLE - MKS24K/MC24M/X

0

M3KKK-1406R

M3KKK-1406R

3M

IDC CABLE - MPK14K/MC14M/MPK14K

0

M3URK-1636J

M3URK-1636J

3M

IDC CABLE - MKS16K/MC16G/MPR16K

0

M3DDK-1618R

M3DDK-1618R

3M

IDC CABLE - MKR16K/MC16M/MKR16K

0

M3DRK-2018J

M3DRK-2018J

3M

IDC CABLE - MKR20K/MC20G/MPR20K

0

M1WXK-4036R

M1WXK-4036R

3M

IDC CABLE - MPL40K/MC40M/X

0

M3URK-2618J

M3URK-2618J

3M

IDC CABLE - MKS26K/MC26G/MPR26K

0

M3AKK-4040K

M3AKK-4040K

3M

IDC CABLE - MSC40K/MC40F/MPK40K

0

M3TTK-2606R

M3TTK-2606R

3M

IDC CABLE - MSD26K/MC26M/MSD26K

0

M1TXK-5040K

M1TXK-5040K

3M

IDC CABLE - MSD50K/MC50F/X

0

M3CMK-5006J

M3CMK-5006J

3M

IDC CABLE - MKC50K/MC50G/MCG50K

0

M3AGK-4036J

M3AGK-4036J

3M

IDC CABLE - MSC40K/MC40G/MCS40K

0

M3CCK-4018J

M3CCK-4018J

3M

IDC CABLE - MKC40K/MC40G/MKC40K

0

M1AXK-1040K

M1AXK-1040K

3M

IDC CABLE - MSC10K/MC10F/X

0

45130-010030-7700/30-B-12

45130-010030-7700/30-B-12

3M

CABLE ASSY 30 POS 12" PINOUT-B

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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