Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
M3TMK-1040K

M3TMK-1040K

3M

IDC CABLE - MSD10K/MC10F/MCG10K

0

M3AGK-3406R

M3AGK-3406R

3M

IDC CABLE - MSC34K/MC34M/MCS34K

0

M1KXK-3036J

M1KXK-3036J

3M

IDC CABLE - MPK30K/MC34G/X

0

M3AKK-5036R

M3AKK-5036R

3M

IDC CABLE - MSC50K/MC50M/MPK50K

8

M3UEK-2620K

M3UEK-2620K

3M

IDC CABLE - MKS26K/MC26F/MCE26K

0

M3UFK-6018J

M3UFK-6018J

3M

IDC CABLE - MKS60K/MC60G/MCF60K

0

M3BFK-1040K

M3BFK-1040K

3M

IDC CABLE - MSR10K/MC10F/MCF10K

0

M1YXK-2636J

M1YXK-2636J

3M

IDC CABLE - MPD26K/MC26G/X

0

M3CFK-2618J

M3CFK-2618J

3M

IDC CABLE - MKC26K/MC26G/MCF26K

0

M3KKK-2636R

M3KKK-2636R

3M

IDC CABLE - MPK26K/MC26M/MPK26K

0

M3BBA-2020K

M3BBA-2020K

3M

IDC CABLE - MSR20A/MC20F/MSR20A

0

M3AEK-1636J

M3AEK-1636J

3M

IDC CABLE - MSC16K/MC16G/MCE16K

0

M1CXA-4036R

M1CXA-4036R

3M

IDC CABLE - MKC40A/MC40M/X

0

M3BBK-3036R

M3BBK-3036R

3M

IDC CABLE - MSR30K/MC34M/MSR30K

0

M3AAA-3440K

M3AAA-3440K

3M

IDC CABLE - MSC34A/MC34F/MSC34A

0

M3UYK-2620K

M3UYK-2620K

3M

IDC CABLE - MKS26K/MC26F/MPD26K

0

M3EEK-1636J

M3EEK-1636J

3M

IDC CABLE - MCE16K/MC16G/MCE16K

0

M3AWK-5060K

M3AWK-5060K

3M

IDC CABLE - MSC50K/MC50F/MPL50K

0

M3CKK-1060K

M3CKK-1060K

3M

IDC CABLE - MKC10K/MC10F/MPK10K

0

M3GGK-6060K

M3GGK-6060K

3M

IDC CABLE - MCS60K/MC60F/MCS60K

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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