Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
M1DXK-2436R

M1DXK-2436R

3M

IDC CABLE - MKR24K/MC24M/X

0

M3GGK-3406J

M3GGK-3406J

3M

IDC CABLE - MCS34K/MC34G/MCS34K

0

M3AAA-1018R

M3AAA-1018R

3M

IDC CABLE - MSC10A/MC10M/MSC10A

0

M3AWK-2006J

M3AWK-2006J

3M

IDC CABLE - MSC20K/MC20G/MPL20K

0

M3TGK-2636R

M3TGK-2636R

3M

IDC CABLE - MSD26K/MC26M/MCS26K

0

M1GXK-1636J

M1GXK-1636J

3M

IDC CABLE - MCS16K/MC16G/X

0

M3CKK-5020K

M3CKK-5020K

3M

IDC CABLE - MKC50K/MC50F/MPK50K

0

M3DFK-6006J

M3DFK-6006J

3M

IDC CABLE - MKR60K/MC60G/MCF60K

0

M3MMK-1018R

M3MMK-1018R

3M

IDC CABLE - MCG10K/MC10M/MCG10K

0

M3AEK-6036R

M3AEK-6036R

3M

IDC CABLE - MSC60K/MC60M/MCE60K

0

M3CFK-6036J

M3CFK-6036J

3M

IDC CABLE - MKC60K/MC60G/MCF60K

0

M3CKK-3036J

M3CKK-3036J

3M

IDC CABLE - MKC30K/MC34G/MPK30K

0

M3EEK-3406J

M3EEK-3406J

3M

IDC CABLE - MCE34K/MC34G/MCE34K

0

M1MXK-3436R

M1MXK-3436R

3M

IDC CABLE - MCG34K/MC34M/X

0

M3CWK-6006J

M3CWK-6006J

3M

IDC CABLE - MKC60K/MC60G/MPL60K

0

M3YYK-3036J

M3YYK-3036J

3M

IDC CABLE - MPD30K/MC34G/MPD30K

0

M3DEK-6018J

M3DEK-6018J

3M

IDC CABLE - MKR60K/MC60G/MCE60K

0

158216-0220-3625/16-S-3

158216-0220-3625/16-S-3

3M

SINGLE ENDED CABLE ASSEMBLY 16 P

0

M3UYK-1006R

M3UYK-1006R

3M

IDC CABLE - MKS10K/MC10M/MPD10K

0

M3DEK-3436R

M3DEK-3436R

3M

IDC CABLE - MKR34K/MC34M/MCE34K

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
RFQ BOM Call Skype Email
Top