Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
M3CKK-3406R

M3CKK-3406R

3M

IDC CABLE - MKC34K/MC34M/MPK34K

0

M3UUK-5018R

M3UUK-5018R

3M

IDC CABLE - MKS50K/MC50M/MKS50K

0

M3CWK-1636R

M3CWK-1636R

3M

IDC CABLE - MKC16K/MC16M/MPL16K

0

M1RXK-1640K

M1RXK-1640K

3M

IDC CABLE - MPR16K/MC16F/X

0

M3DFK-4020K

M3DFK-4020K

3M

IDC CABLE - MKR40K/MC40F/MCF40K

0

M3WWK-5020K

M3WWK-5020K

3M

IDC CABLE - MPL50K/MC50F/MPL50K

0

M3URK-1018R

M3URK-1018R

3M

IDC CABLE - MKS10K/MC10M/MPR10K

0

158110-1100-HF625/10-S-6

158110-1100-HF625/10-S-6

3M

SINGLE ENDED CABLE ASSEMBLY 10 P

0

M3YYK-1618J

M3YYK-1618J

3M

IDC CABLE - MPD16K/MC16G/MPD16K

0

M3CFK-1006J

M3CFK-1006J

3M

IDC CABLE - MKC10K/MC10G/MCF10K

0

M3WWK-2006J

M3WWK-2006J

3M

IDC CABLE - MPL20K/MC20G/MPL20K

0

M1AXK-2640K

M1AXK-2640K

3M

IDC CABLE - MSC26K/MC26F/X

0

M3UEK-2036J

M3UEK-2036J

3M

IDC CABLE - MKS20K/MC20G/MCE20K

0

M3BBK-2006R

M3BBK-2006R

3M

IDC CABLE - MSR20K/MC20M/MSR20K

0

M3BRK-3436R

M3BRK-3436R

3M

IDC CABLE - MSR34K/MC34M/MPR34K

0

M3CEK-5036J

M3CEK-5036J

3M

IDC CABLE - MKC50K/MC50G/MCE50K

0

M3CKK-3036R

M3CKK-3036R

3M

IDC CABLE - MKC30K/MC34M/MPK30K

0

158120-1100-3625/20-S-6

158120-1100-3625/20-S-6

3M

SINGLE ENDED CABLE ASSEMBLY 20 P

50

M3UFK-4036R

M3UFK-4036R

3M

IDC CABLE - MKS40K/MC40M/MCF40K

0

M3DEK-1060K

M3DEK-1060K

3M

IDC CABLE - MKR10K/MC10F/MCE10K

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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