Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
H3BKH-2036G

H3BKH-2036G

ASSMANN WSW Components

IDC CBL - HHSR20H/AE20G/HHPK20H

0

H3CCS-3436M

H3CCS-3436M

ASSMANN WSW Components

IDC CBL - HHKC34S/AE34M/HHKC34S

0

H3WWH-1036G

H3WWH-1036G

ASSMANN WSW Components

IDC CBL - HHPL10H/AE10G/HHPL10H

0

H2PXH-1036G

H2PXH-1036G

ASSMANN WSW Components

DIP CABLE - HDP10H/AE10G/X

0

H3AWH-2036M

H3AWH-2036M

ASSMANN WSW Components

IDC CBL - HHSC20H/AE20M/HHPL20H

0

H6MMS-4036M

H6MMS-4036M

ASSMANN WSW Components

DIP CBL - HHDM40S/AE40M/HHDM40S

0

H3AAH-5018M

H3AAH-5018M

ASSMANN WSW Components

IDC CBL - HHSC50H/AE50M/HHSC50H

0

H6PPH-1418M

H6PPH-1418M

ASSMANN WSW Components

DIP CABLE - HDP14H/AE14M/HDP14H

0

H2MXH-1636G

H2MXH-1636G

ASSMANN WSW Components

DIP CABLE - HDM16H/AE16G/X

0

H2MXS-5018G

H2MXS-5018G

ASSMANN WSW Components

DIP CBL - HHDM50S/AE50G/X

0

H3AKH-1406G

H3AKH-1406G

ASSMANN WSW Components

IDC CBL - HHSC14H/AE14G/HHPK14H

0

H3BBH-6406M

H3BBH-6406M

ASSMANN WSW Components

IDC CBL - HHSR64H/AE64M/HHSR64H

0

H1DXH-4036M

H1DXH-4036M

ASSMANN WSW Components

IDC CBL - HHKR40H/AE40M/X

0

H2MXH-1606G

H2MXH-1606G

ASSMANN WSW Components

DIP CABLE - HDM16H/AE16G/X

0

H8MMH-2406G

H8MMH-2406G

ASSMANN WSW Components

DIP CABLE - HDM24H/AE24G/HDM24H

0

H3CCH-5006M

H3CCH-5006M

ASSMANN WSW Components

IDC CABLE - HKC50H/AE50M/HKC50H

0

H1BXS-1036M

H1BXS-1036M

ASSMANN WSW Components

IDC CBL - HHSR10S/AE10M/X

0

H3BWH-3436M

H3BWH-3436M

ASSMANN WSW Components

IDC CBL - HHSR34H/AE34M/HHPL34H

0

H8MMS-2006M

H8MMS-2006M

ASSMANN WSW Components

DIP CBL - HHDM20S/AE20M/HHDM20S

0

H1BXH-2036G

H1BXH-2036G

ASSMANN WSW Components

IDC CBL - HHSR20H/AE20G/X

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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