Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
06-024-108

06-024-108

Aries Electronics, Inc.

DIP CABLE 6POS

0

06-012-105

06-012-105

Aries Electronics, Inc.

DIP CABLE 6POS

0

14-036-116

14-036-116

Aries Electronics, Inc.

DECI-CENTER JUMPERS 14POS

0

06-012-100

06-012-100

Aries Electronics, Inc.

DIP CABLE 6POS

0

28-036-109

28-036-109

Aries Electronics, Inc.

DIP CABLE 28POS

0

20-036-107

20-036-107

Aries Electronics, Inc.

DIP CABLE 20POS

0

10-036-107

10-036-107

Aries Electronics, Inc.

DIP CABLE 10POS

0

24-012-104

24-012-104

Aries Electronics, Inc.

DIP CABLE 24POS

0

22-012-109

22-012-109

Aries Electronics, Inc.

DIP CABLE 22POS

0

10-024-104

10-024-104

Aries Electronics, Inc.

DIP CABLE 10POS

0

16-024-111

16-024-111

Aries Electronics, Inc.

DIP CABLE 16POS

0

20-012-101

20-012-101

Aries Electronics, Inc.

DIP CABLE 20POS

0

08-012-214

08-012-214

Aries Electronics, Inc.

DIP CABLE M-F 8POS

0

12-012-112

12-012-112

Aries Electronics, Inc.

DECI-CENTER JUMPERS 12POS

0

10-036-114

10-036-114

Aries Electronics, Inc.

DECI-CENTER JUMPERS 10POS

0

40-036-106

40-036-106

Aries Electronics, Inc.

DIP CABLE 40POS

0

06-036-111

06-036-111

Aries Electronics, Inc.

DIP CABLE 6POS

0

12-036-113

12-036-113

Aries Electronics, Inc.

DECI-CENTER JUMPERS 12POS

0

14-012-115

14-012-115

Aries Electronics, Inc.

DECI-CENTER JUMPERS 14POS

0

40-012-106

40-012-106

Aries Electronics, Inc.

DIP CABLE 40POS

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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