Rectangular Cable Assemblies

Part Number	Description / PDF	Quantity
FFSD-05-D-10.01-01-N Samtec, Inc.	.050 X .050 C.L. FEMALE IDC ASSE	0
FFSD-08-D-08.00-01-N Samtec, Inc.	.050 X .050 C.L. FEMALE IDC ASSY	150
T1PS-08-28-GF-02.0-A-T3 Samtec, Inc.	CBL 1MM 8POS PNL MNT M TO F	0
FFSD-25-D-04.00-01-S-N Samtec, Inc.	.050 X .050 C.L. FEMALE IDC ASSE	0
FFSD-13-D-17.75-01-N Samtec, Inc.	.050 X .050 C.L. FEMALE IDC ASSE	0
FFSD-20-D-30.00-01-N-D12 Samtec, Inc.	.050 X .050 C.L. FEMALE IDC ASSE	0
HLCD-40-12.00-TR-TR-1 Samtec, Inc.	CBL ASSM SELF-MATE 80POS 12" HDR	23
FFSD-20-D-04.00-01-N-D02 Samtec, Inc.	.050 X .050 C.L. FEMALE IDC ASSE	0
SEAC-030-04-06.0-TU-TU-N Samtec, Inc.	CBL ASSM M-M 120POS 6" HDR	0
T1PDT-08-28-GF-12.0-A-T3 Samtec, Inc.	CBL 1MM 16POS PNL MNT M TO F	0
TCSD-22-D-18.00-01-F Samtec, Inc.	CABLE IDC 22POS 18"	0
FFSD-10-D-07.50-01-N Samtec, Inc.	.050 X .050 C.L. FEMALE IDC ASSE	0
FFSD-08-D-84.00-01-N Samtec, Inc.	.050 X .050 C.L. FEMALE IDC ASSE	0
HLCD-50-40.00-TR-TR-1 Samtec, Inc.	CBL ASS SELF-MATE 100POS 40" HDR	10
HQCD-060-12.00-TED-SED-1-B Samtec, Inc.	CBL ASSM M-F 120POS 12" HDR	0
FFSD-08-D-07.87-01-N-RW Samtec, Inc.	.050 X .050 C.L. FEMALE IDC ASSE	0
FFSD-15-D-15.00-01-N Samtec, Inc.	.050 X .050 C.L. FEMALE IDC ASSE	0
FFSD-13-D-30.00-01-N-D15 Samtec, Inc.	.050 X .050 C.L. FEMALE IDC ASSE	0
FFSD-05-D-48.00-01-F-N Samtec, Inc.	.050 X .050 C.L. FEMALE IDC ASSE	0
FFSD-17-D-10.63-01-N Samtec, Inc.	.050 X .050 C.L. FEMALE IDC ASSE	0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
D-Subminiature	Metal-shielded, screw-locking design	Industrial computers, military equipment
IDC (Insulation Displacement)	Tool-less termination, flat cable compatibility	Telecom switches, HVAC systems
Board-to-Board	Low-profile, high-pin-count options	Servers, medical imaging devices
Ribbon Cable	Parallel signal routing, flexible dielectric	Computer peripherals, test equipment

3. Structure and Components

Typical construction includes:

Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
Shielding: Braided copper or conductive polymer layers
Strain relief: Molded thermoplastic overbraiding
Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

Parameter	Typical Range	Importance
Rated Voltage	50V - 600V	Ensures dielectric safety
Current Capacity	1A - 15A per contact	Determines power handling
Contact Resistance	5-20m	Impacts signal integrity
Insulation Resistance	100M - 10G	Prevents leakage currents
Operating Temperature	-55 C to +125 C	Environmental reliability
Mating Cycles	500 - 5000 cycles	Durability indicator

5. Application Fields

Primary sectors include:

Computer & Peripherals: Server backplanes, GPU interconnects
Telecommunications: 5G base stations, optical network terminals
Industrial Automation: PLC interfaces, robotic controllers
Medical Equipment: MRI scanners, diagnostic devices
Transportation: EV battery management systems, avionics

6. Leading Manufacturers

Manufacturer	Key Products
Amphenol Corporation	D-Sub 90 PCB Mount Series
TE Connectivity	MATE-AX High-Speed Backplane Cables
Molex LLC	PicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.	QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

Electrical requirements (voltage/current profiles)
Mechanical constraints (space limitations, vibration exposure)
Environmental factors (temperature extremes, chemical exposure)
Signal integrity needs (impedance control, crosstalk reduction)
Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

Miniaturization: 0.4mm pitch connectors for mobile devices
High-speed capabilities: 25+ Gbps differential pair designs
Smart integration: Embedded sensors for condition monitoring
Sustainability focus: Halogen-free materials adoption
Automated manufacturing: AI-driven quality control systems