Between Series Adapter Cables

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0985 706 104/35M

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0985 806 103/80M

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0985 706 103/45M

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0985 656 103/0.3M

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0985 YM57530-W 103/12M

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0985 808 103/45M

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0985 706 103/10M

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0985 706 104/0.25M

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0985 YM57530 103/0.15M

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Lumberg Automation

0985 856 103/40M

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0985 656 103/4M

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Lumberg Automation

0985 806 103/15M

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0985 YM57530 103/0.3M

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0985 808 103/5M

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900004658

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0985 806-U 103/35M

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900004083

Lumberg Automation

0985 806 103/35M

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900004814

900004814

Lumberg Automation

0985 808 103/80M

0

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900004997

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0985 YM57530-N 103/20M

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900004750

900004750

Lumberg Automation

0985 808-N 103/40M

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900005137

900005137

Lumberg Automation

0985 808 104/5M

0

Between Series Adapter Cables

1. Overview

Between Series Adapter Cables are interconnect solutions that bridge incompatible connectors or protocols across different device series. These cables enable seamless data, power, and signal transmission between systems with varying electrical or physical interfaces. As technology ecosystems diversify, these adapters play a critical role in ensuring interoperability in consumer electronics, industrial automation, and telecommunications infrastructure.

2. Major Types & Functional Classification

TypeFunctional FeaturesApplication Examples
USB-A to USB-CSupports USB 3.1 Gen2 (10Gbps), reversible plug orientationLaptop to smartphone charging/data transfer
HDMI to DisplayPort4K@60Hz video conversion, active signal conditioningConnecting gaming consoles to commercial displays
RJ45 to Fiber Optic1000BASE-T to 10GBASE-SR conversionEnterprise network backbone integration
DB9 to USB SerialRS-232 protocol translation via integrated ICLegacy industrial machine monitoring systems

3. Structural & Technical Composition

Typical construction includes:

  • Conductive Core: Oxygen-free copper (OFC) conductors with silver-plated contacts
  • Insulation: Foamed polyethylene dielectric for reduced capacitance
  • Shielding: Multi-layer aluminum-mylar foil + braided copper ( 85% coverage)
  • Connectors: Precision-machined phosphor bronze contacts with 30 " gold plating
  • Active Components: Signal repeaters (for lengths >5m) and protocol conversion ICs

4. Key Technical Specifications

ParameterTypical ValueImportance
Insertion Loss<0.5dB @ 10GHzMaintains signal integrity in high-speed applications
Impedance Matching50 5% (RF variants)Prevents signal reflections in data centers
Voltage Withstanding1000VAC @ 60sSafety compliance for industrial environments
Operating Temperature-40 C to +85 CReliability in automotive/industrial scenarios
Mating Cycles>10,000 cycles (USB-C)Durability metric for frequent connections

5. Application Domains

  • Consumer Electronics: Smartphones (Lightning-USB-C), VR headsets (HDMI-DP)
  • Industrial Automation: PLCs with mixed serial/Ethernet interfaces
  • Medical Devices: MRI machines interfacing with modern diagnostic displays
  • Avionics: ARINC 664 to fiber optic conversion in aircraft cockpits

6. Leading Manufacturers & Products

ManufacturerProduct FamilyKey Features
BelkinUSB-C 3.1 to USB-A Gen2Backward compatible, 10Gbps throughput
Amphenol9116 Series HDMI-DP8K resolution support with EDID management
TE Connectivity1-104286-5IP67-rated industrial Ethernet adapter
Analog DevicesADUM4160USB 2.0 isolation adapter for medical applications

7. Selection Guidelines

Consider these factors during selection:

  • Electrical compatibility (voltage levels, current capacity)
  • Protocol handshake requirements (e.g., USB PD negotiation)
  • Environmental ratings (IP, vibration resistance)
  • Certification requirements (CE, FCC, RoHS)
  • Future-proofing (support for emerging standards like USB4)

Case Study: A data center upgraded from SATA to NVMe storage arrays using U.2 to M.2 adapter cables, achieving 3x throughput improvement without replacing existing infrastructure.

8. Industry Trends

  • Transition to 8K-ready passive optical cables ( 0.1dB/m loss)
  • Miniaturization (sub-1mm pitch connectors for IoT devices)
  • Smart adapters with built-in diagnostics (e.g., Fluke Networks' LinkWare integration)
  • Biodegradable jacket materials (PLA-based TPE compounds)
  • Multi-protocol chips enabling universal adapter designs
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