Between Series Adapter Cables

Part Number	Description / PDF	Quantity
76000264 Digi	CABLE CROSSOVER 4' RJ-45/DB-9M	35
76000195 Digi	CABLE STRAIGHT 4' RJ-45/DB-25M	344
76000645 Digi	CABLE CROSSOVER 4' RJ-45/DB-9F	54
76000199 Digi	CABLE STRAIGHT 4' RJ-45/DB-25F	20
76000238 Digi	CABLE CROSSOVER 4' RJ-45/DB-25M	4
76000201 Digi	CABLE STRAIGHT 4' RJ-45/DB-9F	178
76000240 Digi	CABLE STRAIGHT 4' RJ-45/DB-9M	732
76000643 Digi	CABLE PRINTER 2' RJ-45/DB-25M	0
76000239 Digi	CABLE STRAIGHT 2' RJ-45/DB-9M	0
76000200 Digi	CABLE STRAIGHT 2' RJ-45/DB-9F	0
76000644 Digi	CABLE CROSSOVER 4' RJ-45/DB-25F	0
76000198 Digi	CABLE STRAIGHT 2' RJ-45/DB-25F	0
76000129 Digi	CABLE STRAIGHT 2' RJ-45/DB-25M	0

Between Series Adapter Cables

1. Overview

Between Series Adapter Cables are interconnect solutions that bridge incompatible connectors or protocols across different device series. These cables enable seamless data, power, and signal transmission between systems with varying electrical or physical interfaces. As technology ecosystems diversify, these adapters play a critical role in ensuring interoperability in consumer electronics, industrial automation, and telecommunications infrastructure.

2. Major Types & Functional Classification

Type	Functional Features	Application Examples
USB-A to USB-C	Supports USB 3.1 Gen2 (10Gbps), reversible plug orientation	Laptop to smartphone charging/data transfer
HDMI to DisplayPort	4K@60Hz video conversion, active signal conditioning	Connecting gaming consoles to commercial displays
RJ45 to Fiber Optic	1000BASE-T to 10GBASE-SR conversion	Enterprise network backbone integration
DB9 to USB Serial	RS-232 protocol translation via integrated IC	Legacy industrial machine monitoring systems

3. Structural & Technical Composition

Typical construction includes:

Conductive Core: Oxygen-free copper (OFC) conductors with silver-plated contacts
Insulation: Foamed polyethylene dielectric for reduced capacitance
Shielding: Multi-layer aluminum-mylar foil + braided copper ( 85% coverage)
Connectors: Precision-machined phosphor bronze contacts with 30 " gold plating
Active Components: Signal repeaters (for lengths >5m) and protocol conversion ICs

4. Key Technical Specifications

Parameter	Typical Value	Importance
Insertion Loss	<0.5dB @ 10GHz	Maintains signal integrity in high-speed applications
Impedance Matching	50 5% (RF variants)	Prevents signal reflections in data centers
Voltage Withstanding	1000VAC @ 60s	Safety compliance for industrial environments
Operating Temperature	-40 C to +85 C	Reliability in automotive/industrial scenarios
Mating Cycles	>10,000 cycles (USB-C)	Durability metric for frequent connections

5. Application Domains

Consumer Electronics: Smartphones (Lightning-USB-C), VR headsets (HDMI-DP)
Industrial Automation: PLCs with mixed serial/Ethernet interfaces
Medical Devices: MRI machines interfacing with modern diagnostic displays
Avionics: ARINC 664 to fiber optic conversion in aircraft cockpits

6. Leading Manufacturers & Products

Manufacturer	Product Family	Key Features
Belkin	USB-C 3.1 to USB-A Gen2	Backward compatible, 10Gbps throughput
Amphenol	9116 Series HDMI-DP	8K resolution support with EDID management
TE Connectivity	1-104286-5	IP67-rated industrial Ethernet adapter
Analog Devices	ADUM4160	USB 2.0 isolation adapter for medical applications

7. Selection Guidelines

Consider these factors during selection:

Electrical compatibility (voltage levels, current capacity)
Protocol handshake requirements (e.g., USB PD negotiation)
Environmental ratings (IP, vibration resistance)
Certification requirements (CE, FCC, RoHS)
Future-proofing (support for emerging standards like USB4)

Case Study: A data center upgraded from SATA to NVMe storage arrays using U.2 to M.2 adapter cables, achieving 3x throughput improvement without replacing existing infrastructure.

8. Industry Trends

Transition to 8K-ready passive optical cables ( 0.1dB/m loss)
Miniaturization (sub-1mm pitch connectors for IoT devices)
Smart adapters with built-in diagnostics (e.g., Fluke Networks' LinkWare integration)
Biodegradable jacket materials (PLA-based TPE compounds)
Multi-protocol chips enabling universal adapter designs