Evaluation, Development Board Enclosures

Image Part Number Description / PDF Quantity Rfq
1593HAMAR3BK

1593HAMAR3BK

Hammond Manufacturing

BOX PLASTIC BLK FOR ARDUINO

2

1593HAMMEGABK

1593HAMMEGABK

Hammond Manufacturing

BOX ABS BLACK 4.38"L X 2.95"W

0

1593HAMEGG2TBK

1593HAMEGG2TBK

Hammond Manufacturing

BOX ABS TRN BLK 5.71"L X 3.94"W

0

1593HAMDUETBU

1593HAMDUETBU

Hammond Manufacturing

BOX ABS TRN BLUE 4.38"L X 2.95"W

0

1593HAMUNOBK

1593HAMUNOBK

Hammond Manufacturing

BOX ABS BLACK 4.38"L X 2.95"W

0

1593HAMEGG1TBK

1593HAMEGG1TBK

Hammond Manufacturing

BOX ABS TRN BLK 5.71"L X 3.94"W

0

1593HAMUNOTBU

1593HAMUNOTBU

Hammond Manufacturing

BOX ABS TRN BLUE 4.38"L X 2.95"W

0

1593HAMEGG1TBU

1593HAMEGG1TBU

Hammond Manufacturing

BOX ABS TRN BLUE 5.71"L X 3.94"W

0

1593HAMPI2CLR

1593HAMPI2CLR

Hammond Manufacturing

BOX ABS TRN CLR 3.88"L X 2.74"W

0

1593HAMPICLR

1593HAMPICLR

Hammond Manufacturing

BOX ABS TRN CLR 4.1"L X 2.59"W

0

1593HAMFREE1BK

1593HAMFREE1BK

Hammond Manufacturing

BOX ABS BLACK 3.63"L X 2.61"W

0

1593HAMEGG2TBU

1593HAMEGG2TBU

Hammond Manufacturing

BOX ABS TRN BLUE 5.71"L X 3.94"W

0

1593HAMMEGATBU

1593HAMMEGATBU

Hammond Manufacturing

BOX ABS TRN BLUE 4.38"L X 2.95"W

0

1593HAMEGG1TPU

1593HAMEGG1TPU

Hammond Manufacturing

BOX ABS TRN PURPLE 5.71"LX3.94"W

0

1593HAMDUEBK

1593HAMDUEBK

Hammond Manufacturing

BOX ABS BLACK 4.38"L X 2.95"W

0

1593HAMPI2BK

1593HAMPI2BK

Hammond Manufacturing

BOX ABS BLACK 3.88"L X 2.74"W

0

1593HAMFREE2TBU

1593HAMFREE2TBU

Hammond Manufacturing

BOX ABS TRN BLUE 3.63"L X 2.61"W

0

1593HAMPIBK

1593HAMPIBK

Hammond Manufacturing

BOX ABS BLACK 4.1"L X 2.59"W

0

1593HAMPI2GY

1593HAMPI2GY

Hammond Manufacturing

BOX ABS GRAY 3.88"L X 2.74"W

0

1593HAMMEGAGY

1593HAMMEGAGY

Hammond Manufacturing

BOX ABS GRAY 4.38"L X 2.95"W

0

Evaluation, Development Board Enclosures

1. Overview

Development board enclosures are protective housings designed to safeguard electronic development boards while enabling functional access. These enclosures provide mechanical protection, electromagnetic interference (EMI) shielding, thermal management, and environmental resistance. They play a critical role in prototyping, industrial automation, IoT deployments, and educational platforms by ensuring reliable operation under various conditions.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Plastic EnclosuresLightweight, cost-effective, insulating propertiesEducational kits, hobbyist projects
Metal EnclosuresSuperior EMI shielding, thermal dissipationIndustrial control systems
Modular EnclosuresCustomizable compartments, tool-less assemblyRapid prototyping environments
IP-Rated EnclosuresWater/dust resistance (IP65-IP67)Outdoor IoT sensors

3. Structure and Components

Typical enclosures consist of: - Base chassis: Provides structural integrity and mounting points - Removable panels: Allow access to interfaces and expansion slots - Heat dissipation features: Ventilation grids or embedded heat sinks - EMI shielding: Conductive gaskets or metalized coatings - Cable management: Strain relief ports and routing channels

4. Key Technical Specifications

ParameterImportance
Material Type (ABS/Aluminum/Steel)Determines weight, durability, and shielding
Dimensional Range (50-500mm)Affects board compatibility
IP Rating (IP54-IP68)Defines environmental protection level
Thermal ResistanceImpacts sustained performance in enclosed spaces
Vibration ResistanceCritical for industrial/automotive applications

5. Application Fields

  • IoT Infrastructure: Smart city sensors (e.g., Raspberry Pi housed in IP67 enclosures)
  • Industrial Automation: PLC control panels with EMI-shielded aluminum cases
  • Medical Devices: Diagnostic equipment development platforms
  • Education: STEM kits with transparent plastic enclosures

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
Raspberry Pi FoundationOfficial Raspberry Pi 4 Enclosure with active cooling
Arduino SAArduino Uno Transparent Plastic Case
EbenIndustrial Metal Enclosure for Jetson Nano
RS ProModular DIN Rail Mount Enclosure

7. Selection Guidelines

Key considerations include: - Board form factor compatibility (e.g., HAT/Shield alignment) - Operating environment (temperature, humidity, vibration) - Required certifications (CE, RoHS) - Expandability for future hardware upgrades - Cost vs. performance trade-offs

8. Industry Trends Analysis

Emerging trends include: - Integration of thermal interface materials (TIMs) in plastic enclosures - Adoption of additive manufacturing for customized geometries - Increased demand for 5G-compatible EMI shielding solutions - Growth of edge computing driving ruggedized enclosure requirements - Sustainability focus driving bio-based polymer enclosures

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