Evaluation, Development Board Enclosures

Part Number	Description / PDF	Quantity
BW22ABKASNO Serpac Electronic Enclosures	ENCL WRIST BLK 1.51X1.74X0.55"	2
CX21ABKANG Serpac Electronic Enclosures	ENCL IP67 BLK 1.51X1.74X0.45"	1
CX23ABKAGM Serpac Electronic Enclosures	ENCL IP67 BLK 1.51X1.74X0.44"	10
BW23ABKASYL Serpac Electronic Enclosures	ENCL WRIST BLK 1.51X1.74X0.44"	2
BW22ABKASBK Serpac Electronic Enclosures	ENCL WRIST BLK 1.51X1.74X0.55"	34
BW28ABKASYL Serpac Electronic Enclosures	ENCL WRIST BLK 1.51X1.74X0.75"	11
BW20ABKASOR Serpac Electronic Enclosures	ENCL WRIST BLK 1.51X1.74X0.35"	2
CX27ABKABL Serpac Electronic Enclosures	ENCL IP67 BLK 1.51X1.74X0.65"	2
CX22ABKANG Serpac Electronic Enclosures	ENCL IP67 BLK 1.51X1.74X0.55"	2
CX22ABKABL Serpac Electronic Enclosures	ENCL IP67 BLK 1.51X1.74X0.55"	2
CX25ABKABK Serpac Electronic Enclosures	ENCL IP67 BLK 1.51X1.74X0.64"	10
CX27ABKANG Serpac Electronic Enclosures	ENCL IP67 BLK 1.51X1.74X0.65"	2
BW22ABKASGM Serpac Electronic Enclosures	ENCL WRIST BLK 1.51X1.74X0.55"	8
BW23ABKASBL Serpac Electronic Enclosures	ENCL WRIST BLK 1.51X1.74X0.44"	2
CX25ABKAGM Serpac Electronic Enclosures	ENCL IP67 BLK 1.51X1.74X0.64"	8
CX26ABKABL Serpac Electronic Enclosures	ENCL IP67 BLK 1.51X1.74X0.55"	2
BW24ABKASGM Serpac Electronic Enclosures	ENCL WRIST BLK 1.51X1.74X0.54"	10
BW22ABKASNG Serpac Electronic Enclosures	ENCL WRIST BLK 1.51X1.74X0.55"	2
BW24ABKASBK Serpac Electronic Enclosures	ENCL WRIST BLK 1.51X1.74X0.44"	7
CX25ABKANO Serpac Electronic Enclosures	ENCL IP67 BLK 1.51X1.74X0.64"	2

Evaluation, Development Board Enclosures

1. Overview

Development board enclosures are protective housings designed to safeguard electronic development boards while enabling functional access. These enclosures provide mechanical protection, electromagnetic interference (EMI) shielding, thermal management, and environmental resistance. They play a critical role in prototyping, industrial automation, IoT deployments, and educational platforms by ensuring reliable operation under various conditions.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Plastic Enclosures	Lightweight, cost-effective, insulating properties	Educational kits, hobbyist projects
Metal Enclosures	Superior EMI shielding, thermal dissipation	Industrial control systems
Modular Enclosures	Customizable compartments, tool-less assembly	Rapid prototyping environments
IP-Rated Enclosures	Water/dust resistance (IP65-IP67)	Outdoor IoT sensors

3. Structure and Components

Typical enclosures consist of: - Base chassis: Provides structural integrity and mounting points - Removable panels: Allow access to interfaces and expansion slots - Heat dissipation features: Ventilation grids or embedded heat sinks - EMI shielding: Conductive gaskets or metalized coatings - Cable management: Strain relief ports and routing channels

4. Key Technical Specifications

Parameter	Importance
Material Type (ABS/Aluminum/Steel)	Determines weight, durability, and shielding
Dimensional Range (50-500mm)	Affects board compatibility
IP Rating (IP54-IP68)	Defines environmental protection level
Thermal Resistance	Impacts sustained performance in enclosed spaces
Vibration Resistance	Critical for industrial/automotive applications

5. Application Fields

IoT Infrastructure: Smart city sensors (e.g., Raspberry Pi housed in IP67 enclosures)
Industrial Automation: PLC control panels with EMI-shielded aluminum cases
Medical Devices: Diagnostic equipment development platforms
Education: STEM kits with transparent plastic enclosures

6. Leading Manufacturers and Products

Manufacturer	Representative Product
Raspberry Pi Foundation	Official Raspberry Pi 4 Enclosure with active cooling
Arduino SA	Arduino Uno Transparent Plastic Case
Eben	Industrial Metal Enclosure for Jetson Nano
RS Pro	Modular DIN Rail Mount Enclosure

7. Selection Guidelines

Key considerations include: - Board form factor compatibility (e.g., HAT/Shield alignment) - Operating environment (temperature, humidity, vibration) - Required certifications (CE, RoHS) - Expandability for future hardware upgrades - Cost vs. performance trade-offs

8. Industry Trends Analysis

Emerging trends include: - Integration of thermal interface materials (TIMs) in plastic enclosures - Adoption of additive manufacturing for customized geometries - Increased demand for 5G-compatible EMI shielding solutions - Growth of edge computing driving ruggedized enclosure requirements - Sustainability focus driving bio-based polymer enclosures