| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Seeed |
RE_COMPUTER CASE: SIDE PANELS FO |
50 |
|
 |
Seeed |
CASE PLASTIC ORG/WHT 2.84"X1.34" |
0 |
|
 |
Seeed |
CASE PLASTIC CLEAR 3.15"LX2.64"W |
0 |
|
 |
Seeed |
ARGON POLY+ RASPBERRY PI 4 CASE |
6 |
|
 |
Seeed |
RE_COMPUTER CASE: SIDE PANELS FO |
20 |
|
 |
Seeed |
RE_COMPUTER CASE: SIDE PANELS FO |
20 |
|
 |
Seeed |
ARGON ONE M.2 ALUMINUM CASE FOR |
36 |
|
 |
Seeed |
ABS H-TYPE BLACK CASE FOR RASPBE |
0 |
|
 |
Seeed |
CASE PLASTIC BLACK |
21 |
|
 |
Seeed |
CASE PLASTIC CLEAR 3.74"LX2.58"W |
6 |
|
 |
Seeed |
ACRYLIC CASE FOR JETSON NANO B01 |
17 |
|
 |
Seeed |
ABS ENCLOSURE BLACK CASE FOR RAS |
176 |
|
 |
Seeed |
RE_COMPUTER CASE - 2.5 INCH SSD |
78 |
|
 |
Seeed |
ARMOR ALUMINUM METAL CASE WITH D |
98 |
|
 |
Seeed |
CASE ABS BLACK 3.54"L X 2.36"W |
130 |
|
 |
Seeed |
ACRYLIC CASE FOR SEEEDUINO XIAO |
21 |
|
 |
Seeed |
RASPBERRY PI ABS ENCLOSURE W/COO |
10 |
|
 |
Seeed |
RF EXPLORER SLIM HOLDER |
0 |
|
 |
Seeed |
BLACK CASE WITH SINGLE FAN (SUPP |
103 |
|
 |
Seeed |
INDUSTRIAL CASE FOR ODYSSEY X86J |
0 |
|
Development board enclosures are protective housings designed to safeguard electronic development boards while enabling functional access. These enclosures provide mechanical protection, electromagnetic interference (EMI) shielding, thermal management, and environmental resistance. They play a critical role in prototyping, industrial automation, IoT deployments, and educational platforms by ensuring reliable operation under various conditions.
| Type | Functional Features | Application Examples |
|---|---|---|
| Plastic Enclosures | Lightweight, cost-effective, insulating properties | Educational kits, hobbyist projects |
| Metal Enclosures | Superior EMI shielding, thermal dissipation | Industrial control systems |
| Modular Enclosures | Customizable compartments, tool-less assembly | Rapid prototyping environments |
| IP-Rated Enclosures | Water/dust resistance (IP65-IP67) | Outdoor IoT sensors |
Typical enclosures consist of: - Base chassis: Provides structural integrity and mounting points - Removable panels: Allow access to interfaces and expansion slots - Heat dissipation features: Ventilation grids or embedded heat sinks - EMI shielding: Conductive gaskets or metalized coatings - Cable management: Strain relief ports and routing channels
| Parameter | Importance |
|---|---|
| Material Type (ABS/Aluminum/Steel) | Determines weight, durability, and shielding | Dimensional Range (50-500mm) | Affects board compatibility |
| IP Rating (IP54-IP68) | Defines environmental protection level |
| Thermal Resistance | Impacts sustained performance in enclosed spaces |
| Vibration Resistance | Critical for industrial/automotive applications |
| Manufacturer | Representative Product |
|---|---|
| Raspberry Pi Foundation | Official Raspberry Pi 4 Enclosure with active cooling |
| Arduino SA | Arduino Uno Transparent Plastic Case |
| Eben | Industrial Metal Enclosure for Jetson Nano |
| RS Pro | Modular DIN Rail Mount Enclosure |
Key considerations include: - Board form factor compatibility (e.g., HAT/Shield alignment) - Operating environment (temperature, humidity, vibration) - Required certifications (CE, RoHS) - Expandability for future hardware upgrades - Cost vs. performance trade-offs
Emerging trends include: - Integration of thermal interface materials (TIMs) in plastic enclosures - Adoption of additive manufacturing for customized geometries - Increased demand for 5G-compatible EMI shielding solutions - Growth of edge computing driving ruggedized enclosure requirements - Sustainability focus driving bio-based polymer enclosures