Card Guides

Image Part Number Description / PDF Quantity Rfq
1594DD5

1594DD5

Hammond Manufacturing

GUIDE PC CARD 1594D SERIES 1=5

9

1594EZ25

1594EZ25

Hammond Manufacturing

GUIDE PC CARD 25 SETS OF 4 BLK

10

1594ED5

1594ED5

Hammond Manufacturing

GUIDE PC CARD 1594E SERIES 1=5

13

1594CD5

1594CD5

Hammond Manufacturing

GUIDE PC CARD 1594C SERIES 1=5

8

1594BZ25

1594BZ25

Hammond Manufacturing

GUIDE PC CARD 1594B SERIES 1=25

10

1594BD5

1594BD5

Hammond Manufacturing

GUIDE PC CARD 1594B SERIES 1=5

0

1594DZ25

1594DZ25

Hammond Manufacturing

GUIDE PC CARD 1594D SERIES 1=25

10

1594AZ25

1594AZ25

Hammond Manufacturing

GUIDE PC CARD 1594A SERIES 1=25

10

1594AD5

1594AD5

Hammond Manufacturing

GUIDE PC CARD 1594A SERIES 1=5

0

1594CZ25

1594CZ25

Hammond Manufacturing

GUIDE PC CARD 1594C SERIES 1=25

0

Card Guides

1. Overview

Card Guides are mechanical components designed to guide, support, and align printed circuit boards (PCBs) or electronic cards within enclosures, racks, or chassis. They ensure proper insertion, prevent physical damage during installation, and maintain structural integrity in vibration-prone environments. Their importance in modern electronics lies in enhancing system reliability, simplifying maintenance, and standardizing hardware integration across industries.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Fixed Card GuidesRigid mounting, non-adjustable dimensionsStandard server racks, telecom chassis
Sliding Card GuidesTelescopic rails for easy card insertion/removalData center blade servers, modular switches
Adjustable Card GuidesVariable width settings for multiple card sizesMultifunctional industrial control cabinets
Modular Card GuidesInterchangeable components for customized layoutsHigh-density network equipment
Anti-Vibration Card GuidesShock absorption with damping materialsAerospace avionics, military vehicles

3. Structure and Components

Typical card guides consist of:

  • Guide rails (steel/aluminum with powder coating)
  • Retention clips (nylon or stainless steel)
  • Adjustment mechanisms (screw/bolt systems)
  • Mounting brackets (L-shaped or right-angle designs)
  • Anti-friction coatings (Teflon or anodized layers)
Integration with grounding clips and labeling systems is common in high-end models.

4. Key Technical Specifications

ParameterValue RangeImportance
Load Capacity5-50 kg per railDetermines maximum supported card weight
Rail Length100-800 mmAffects compatibility with chassis depth
Adjustment Range 5-25 mmDictates versatility for different card widths
Material Hardness60-90 Shore DImpacts wear resistance and durability
Operating Temperature-40 C to +85 CDefines environmental adaptability

5. Application Fields

Main industries include:

  • Information Technology: Server racks, data storage systems
  • Telecommunications: 5G base stations, optical network units
  • Industrial Automation: PLC control cabinets, SCADA systems
  • Medical Equipment: MRI scanners, diagnostic imaging systems
  • Aerospace: Flight control computers, satellite communication modules
Typical equipment: Cisco Catalyst switches, Dell PowerEdge servers, Siemens SIMATIC controllers.

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Feature
PanduitU.2 NVMe SSD Guiding KitsTool-less installation system
HellermannTytonModuLINE 4000 Series3D adjustable mounting points
TE ConnectivityCard-Lok Guiding SystemIntegrated EMI shielding
Cable Management LtdHeavy-Duty Sliding RailsSelf-lubricating polymer coating

7. Selection Recommendations

Key considerations:

  • Match rail length to chassis depth (allow 5-10mm tolerance)
  • Select load capacity with 20% safety margin above expected weight
  • Choose corrosion-resistant materials for humid environments
  • Specify EMI shielding for sensitive communication equipment
  • Consider tool-less designs for frequent maintenance scenarios
Example: For a 42U data center rack with mixed 2.5"/3.5" SSDs, recommend sliding card guides with 15kg load capacity and quick-release clips.

8. Industry Trends

Emerging developments include:

  • Miniaturization for high-density 4U form factor equipment
  • Smart integration with IoT-enabled vibration monitoring sensors
  • Use of composite materials reducing weight by 30% vs. steel
  • Standardization of quick-install interfaces (e.g., M.3 PCIe SSD guides)
  • Increased adoption of self-lubricating polymer composites
The global market is projected to grow at 6.2% CAGR through 2030, driven by 5G infrastructure and edge computing demands.

RFQ BOM Call Skype Email
Top