| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Richco, Inc. (Essentra Components) |
INSERTER/EXTRACTOR .075" |
401 |
|
 |
Richco, Inc. (Essentra Components) |
CARD PULL NATURAL |
125 |
|
 |
Richco, Inc. (Essentra Components) |
INSERTER/EXTRACTOR .100X.35" |
1114 |
|
 |
Richco, Inc. (Essentra Components) |
ROLL PIN ROUND 1/8 X 3/8" |
996 |
|
 |
Richco, Inc. (Essentra Components) |
CARD EJECTOR WHITE 1/16" |
0 |
|
 |
Richco, Inc. (Essentra Components) |
CARD EJECTOR WHITE 3/32" |
0 |
|
 |
Richco, Inc. (Essentra Components) |
CARD EJECTOR WHITE 1/8" |
0 |
|
 |
Richco, Inc. (Essentra Components) |
CARD EJECTOR WHITE 1/8" |
0 |
|
 |
Richco, Inc. (Essentra Components) |
CARD EJECTOR WHITE 3/32" |
0 |
|
 |
Richco, Inc. (Essentra Components) |
CARD EJECTOR WHITE 3/32" |
0 |
|
 |
Richco, Inc. (Essentra Components) |
CARD EJECTOR WHITE 3/32" |
0 |
|
 |
Richco, Inc. (Essentra Components) |
INSERTER/EXTRACTOR .140X.125" |
0 |
|
 |
Richco, Inc. (Essentra Components) |
INSERTER/EXTRACTOR .140X.35" |
0 |
|
 |
Richco, Inc. (Essentra Components) |
CARD EJECTOR WHITE 3/32" |
0 |
|
 |
Richco, Inc. (Essentra Components) |
INSERTER/EXTRACTOR .140X.35" |
0 |
|
 |
Richco, Inc. (Essentra Components) |
CIRCUIT BOARD EJECTORS BLUE |
0 |
|
|
Richco, Inc. (Essentra Components) |
CIRCUIT BOARD EJECTORS GREEN |
0 |
|
|
Richco, Inc. (Essentra Components) |
CIRCUIT BOARD EJECTORS RED |
0 |
|
|
Richco, Inc. (Essentra Components) |
HINGED SNAP-ON EJECTOR |
0 |
|
|
Richco, Inc. (Essentra Components) |
CIRCUIT BOARD EJECTORS BROWN |
0 |
|
Card Guide Accessories are mechanical components designed to support, align, and secure electronic modules, racks, and enclosures in industrial and IT infrastructure systems. These accessories ensure structural stability, facilitate thermal management, and enable efficient installation/maintenance of equipment. Their importance has grown with the increasing complexity of data centers, telecommunications networks, and industrial automation systems, where precise mechanical alignment and vibration resistance are critical.
| Type | Functional Features | Application Examples |
|---|---|---|
| Fixed Card Guides | Rigid mounting for permanent installations | Industrial control panels |
| Adjustable Guides | Modular width adjustment for variable module sizes | Server racks in data centers |
| Sliding Guides | Telescopic rails for front-access maintenance | Network switches, blade servers |
| Vertical Mounting Kits | Space-optimized vertical installation | Wall-mounted telecom cabinets |
Typical card guide systems consist of: - Load-bearing rails (aluminum/steel alloys) - Anti-vibration mounts (rubber or polymer dampers) - Quick-release mechanisms (spring-loaded latches) - Thermal interface materials (conductive pads or channels) - Mounting brackets (precision-machined aluminum)
| Parameter | Value Range | Importance |
|---|---|---|
| Load Capacity | 5-100kg per rail | Determines system stability |
| Material Thickness | 1.2-3.0mm | Affects durability and vibration resistance |
| Thermal Conductivity | 50-200 W/m K | Enables passive cooling |
| Corrosion Resistance | 1000-2000h salt spray rating | Ensures longevity in harsh environments |
| Installation Tolerance | 0.5mm | Guarantees proper module alignment |
| Manufacturer | Product Line | Key Features |
|---|---|---|
| Panduit | SmartRack Sliding Rails | Tool-free installation, 45kg load capacity |
| Rittal | TS 8 Modular Guides | Quick-lock system, IP20 rating |
| Cabinet Mount | CM-4000 Adjustable Guides | Variable width (19"-24"), EMI shielding |
| Middle Atlantic | DDS Series | Integrated cable management, vibration damping |
Key selection criteria include: - Environmental Conditions: Temperature (-40 C to +85 C), humidity tolerance - Compatibility: Match EIA-310-D standards for 19" racks - Expandability: Choose modular systems for future upgrades - Vibration Requirements: Select guides with MIL-STD-810G certification for seismic zones
Case Study: A hyperscale data center implemented Rittal TS 8 guides to support 24/7 server operations, achieving 30% faster maintenance cycles through their quick-release mechanism.
Emerging developments include: - Integration with IoT sensors for real-time vibration monitoring - Adoption of composite materials reducing weight by 40% vs. steel - AI-driven thermal optimization using embedded temperature sensors - Increased demand for 2U-4U high-density mounting solutions in 5G infrastructure