| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Schroff / nVent |
BACKPLANE 3U 5 CHAN COMPACTPCI |
0 |
|
 |
Schroff / nVent |
BACKPLANE 6U 5 CHAN VME J1/J2 |
3 |
|
 |
Schroff / nVent |
BACKPLANE 6U 21 CHAN VME J1/J2 |
0 |
|
 |
Schroff / nVent |
BACKPLANE 3U 21 CHAN VME J1 |
1 |
|
 |
Schroff / nVent |
BACKPLANE 3U 7 CHAN VME J1 |
2 |
|
 |
Schroff / nVent |
BACKPLANE 3U 4 CHAN VME J1 |
2 |
|
 |
Schroff / nVent |
BACKPLANE 3U 10 CHAN VME J1 |
5 |
|
 |
Schroff / nVent |
BACKPLANE 3U 5 CHAN COMPACTPCI |
0 |
|
 |
Schroff / nVent |
BACKPLANE 6U 5 CHAN COMPACTPCI |
0 |
|
 |
Schroff / nVent |
BACKPLANE 3U 4 CHAN COMPACTPCI |
0 |
|
 |
Schroff / nVent |
BACKPLANE 3U 8 CHAN COMPACTPCI |
2 |
|
 |
Schroff / nVent |
BACKPLANE 3U 5 CHAN VME J1 |
6 |
|
 |
Schroff / nVent |
BACKPLANE 6U 10 CHAN VME J1/J2 |
0 |
|
 |
Schroff / nVent |
BACKPLANE 6U 4 CHAN COMPACTPCI |
0 |
|
 |
Schroff / nVent |
BACKPLANE 6U 8 CHAN VME J1/J2 |
0 |
|
 |
Schroff / nVent |
BACKPLANE 6U 9 CHAN VME J1/J2 |
0 |
|
Backplanes are fundamental components in electronic systems, serving as central connectivity hubs that enable communication between multiple printed circuit boards (PCBs) or modules. They provide electrical connections, signal routing, and mechanical support in complex systems. Modern backplanes are critical in data centers, telecommunications, industrial automation, and high-performance computing, offering scalable and reliable infrastructure for demanding applications.
| Type | Functional Features | Application Examples |
| Passive Backplanes | No active circuitry, purely physical/electrical connections | Industrial PCs, modular test equipment |
| Active Backplanes | Integrated circuitry for signal conditioning, clocking | Telecom switches, enterprise servers |
| High-Speed Backplanes | Optimized for >10 Gbps signaling with impedance control | Data center switches, 5G base stations |
| Storage Backplanes | Specialized interfaces for SAS/SATA drives | RAID arrays, storage servers |
A typical backplane consists of: - Multi-layer PCB with controlled impedance traces - High-density connectors (e.g., PCIe, SAS, RF) - Power distribution networks - EMI shielding structures - Mechanical mounting features Advanced designs incorporate integrated circuitry for signal retiming, clock distribution, and diagnostic features. Modular backplanes may include hot-swappable interfaces and redundant power paths.
| Parameter | Description | Importance |
| Slot Density | Number of module connectors per unit area | System scalability and footprint optimization |
| Signal Bandwidth | Maximum data transfer rate (GHz/Gbps) | Determines application suitability for high-speed systems |
| Power Capacity | Current/voltage handling capabilities | Supports power-hungry components and system stability |
| Thermal Resistance | Ability to dissipate heat ( C/W) | Directly affects reliability and MTBF |
| Protocol Compatibility | Support for standards like PCIe 5.0, SAS 4.0 | Ensures component interoperability |
Primary industries include: - Telecommunications (5G infrastructure, core routers) - Data Centers (cloud servers, storage arrays) - Industrial Automation (PLC systems, test equipment) - Medical Imaging (modular diagnostic systems) - Aerospace & Defense (ruggedized avionics) Case Study: A hyperscale data center deploying 4U server racks with PCIe 5.0 backplanes achieved 2x throughput improvement while reducing power consumption by 18% compared to previous generation architectures.
| Manufacturer | Key Products |
| Avnet | OpenVPX backplanes for military radar systems |
| TE Connectivity | Meg-Array high-speed backplane connectors |
| Samtec | FireFly optical backplane solutions |
| Amphenol | OSP80 80Gbps backplane interconnects |
Key considerations: 1. Define bandwidth requirements with future growth margin (typically 30% headroom) 2. Verify protocol compatibility with existing infrastructure 3. Evaluate thermal management needs based on system power density 4. Consider modular designs for easy upgrades 5. Prioritize vendors with proven field reliability (>1M MTBF) 6. Assess customization capabilities for specialized applications
Current development directions include: - Adoption of 112 Gbps SerDes technology - Integration of optical interconnects (Silicon Photonics) - Development of liquid-cooled backplane solutions - Increased adoption of Open Compute Project (OCP) standards - AI-driven predictive maintenance capabilities Market growth projected at 7.2% CAGR through 2030, driven by 5G and edge computing demands.