Buzzer Elements, Piezo Benders

Image Part Number Description / PDF Quantity Rfq
CEB-27FD44

CEB-27FD44

CUI Devices

BUZZER ELEMENT FDBK 4.5KHZ 27MM

0

CEB-27D44

CEB-27D44

CUI Devices

BUZZER ELEMENT STD 4.6KHZ 27MM

7679

CPT-2745-L100

CPT-2745-L100

CUI Devices

BUZZER ELEMENT FDBK 4.5KHZ 27MM

424

CPT-2064-L100

CPT-2064-L100

CUI Devices

BUZZER ELEMENT FDBK 6.4KHZ 20MM

220

CEB-20D64

CEB-20D64

CUI Devices

BUZZER ELEMENT STD 6.5KHZ 20MM

9495

CEB-35D26

CEB-35D26

CUI Devices

BUZZER ELEMENT STD 2.6KHZ 35MM

1819

CPT-2746-L100

CPT-2746-L100

CUI Devices

BUZZER ELEMENT STD 4.6KHZ 27MM

0

CEB-20FD64

CEB-20FD64

CUI Devices

BUZZER ELEMENT FDBK 6.4KHZ 20MM

12305

CPT-2065-L100

CPT-2065-L100

CUI Devices

BUZZER ELEMENT STD 6.5KHZ 20MM

444

CEB-44D06

CEB-44D06

CUI Devices

BUZZER ELEMENT STD 600HZ 44MM

570

CEB-35FD29

CEB-35FD29

CUI Devices

BUZZER ELEMENT FDBK 2.9KHZ 35MM

2535

CPT-3529-L100

CPT-3529-L100

CUI Devices

BUZZER ELEMENT FDBK 2.9KHZ 35MM

1961

CPT-3526-L100

CPT-3526-L100

CUI Devices

BUZZER ELEMENT STD 2.6KHZ 35MM

448

Buzzer Elements, Piezo Benders

1. Overview

Buzzer elements and piezo benders are electroacoustic transducers based on the piezoelectric effect. Buzzer elements generate audible sound through mechanical vibration when subjected to an electric field, while piezo benders utilize flexible piezoceramic materials to convert electrical energy into mechanical displacement. These components play critical roles in modern electronics for audible alerts, precision actuation, and sensor applications.

2. Main Types and Functional Classification

Type Function Features Application Examples
Piezoelectric Buzzer Elements High-frequency tone generation, compact size, low power consumption Alarm systems, consumer electronics, medical devices
Single-layer Piezo Benders Simple structure, low-voltage operation, moderate displacement Valve control, microfluidic pumps, tactile feedback
Multi-layer Piezo Benders Amplified displacement, high force output, complex motion control Industrial automation, precision positioning, aerospace actuators
Surface-mount Piezo Devices Miniaturized SMD packaging, automated assembly compatibility Wearable devices, IoT sensors, automotive electronics

3. Structure and Composition

Typical construction includes:

  • Piezoceramic layer (PZT, PMN-PT materials)
  • Metal substrate (brass, stainless steel, or flexible PCB)
  • Electrode layers (silver, gold, or ITO coatings)
  • Protective encapsulation (epoxy resin or polymer coating)
Resonant cavity structures optimize acoustic performance in buzzers, while benders employ cantilever or unimorph designs for mechanical displacement.

4. Key Technical Specifications

Parameter Description
Operating Voltage 3-15V DC for buzzers, 10-200V AC for high-displacement benders
Resonant Frequency 1-10 kHz range determines audible pitch and efficiency
Sound Pressure Level (SPL) 70-110 dB at 10cm distance for buzzers
Displacement Range 0.1-5mm depending on layer configuration
Temperature Stability Operational range: -40 C to +85 C

5. Application Areas

  • Consumer Electronics: Smartwatches, smartphones, home appliances
  • Industrial Equipment: Machinery status alerts, valve actuators
  • Medical Devices: Infusion pumps, diagnostic equipment
  • Automotive Systems: Seatbelt reminders, fuel injector controls
  • Telecommunications: Network equipment alarms

6. Leading Manufacturers and Products

Manufacturer Representative Product
Murata Manufacturing PKMCS040A3H-Z
Panasonic Electronic Components ENV-40DRW
TE Connectivity 1-1431485-1
CUI Devices PB-4055-SMT

7. Selection Guidelines

Key considerations:

  • Required sound pressure level and frequency characteristics
  • Environmental conditions (temperature, humidity, vibration)
  • Power supply constraints and current limitations
  • Physical size and mounting method compatibility
  • Reliability requirements (MTBF > 100,000 hours typical)
For piezo benders, evaluate displacement-force trade-offs and actuation speed requirements.

8. Industry Trends

Emerging developments include:

  • Miniaturization for wearable device integration
  • Energy-efficient designs using novel piezoelectric materials
  • Integration with MEMS technology for smart actuators
  • Increased adoption in IoT sensors and haptic feedback systems
  • Development of lead-free piezoceramics for environmental compliance
Market growth projected at 6.2% CAGR through 2030 driven by automotive and medical electronics demand.

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