Buzzer Elements, Piezo Benders

Image Part Number Description / PDF Quantity Rfq
AB2040S-LW100-R

AB2040S-LW100-R

PUI Audio, Inc.

BUZZER ELEMENT STD 4KHZ 20MM

4738

AB1290B-LW100-R

AB1290B-LW100-R

PUI Audio, Inc.

BUZZER ELEMENT STD 9KHZ 12MM

1562

AB2036B

AB2036B

PUI Audio, Inc.

BUZZER ELEMENT STD 3.6KHZ 20MM

2180

AB2734B-LW100-R

AB2734B-LW100-R

PUI Audio, Inc.

BUZZER ELEMENT STD 3.4KHZ 27MM

277

AB4113B

AB4113B

PUI Audio, Inc.

BUZZER ELEMENT STD 1.3KHZ 41MM

893

AB2734B-LWT80-R

AB2734B-LWT80-R

PUI Audio, Inc.

BUZZER ELEMENT CERAMIC BENDER

0

AB2025B-LWC30-R

AB2025B-LWC30-R

PUI Audio, Inc.

BUZZER ELEMENT STD 2.5KHZ 20MM

0

AB1548B-3-LW76-R

AB1548B-3-LW76-R

PUI Audio, Inc.

BUZZER ELEMENT STD 4KHZ 15MM

0

AB2726B-LW71-R

AB2726B-LW71-R

PUI Audio, Inc.

BUZZER ELEMENT STD 2.6KHZ 27MM

0

AB2020B-2

AB2020B-2

PUI Audio, Inc.

BUZZER ELEMENT STD 2KHZ 20MM

0

AB2020B-3

AB2020B-3

PUI Audio, Inc.

BUZZER ELEMENT STD 2KHZ 20MM

0

AB2725S-LW102-R

AB2725S-LW102-R

PUI Audio, Inc.

BUZZER ELEMENT STD 2.5KHZ 27MM

0

AB4129B-D

AB4129B-D

PUI Audio, Inc.

BUZZER ELEMENT STD 2.9KHZ 41MM

0

Buzzer Elements, Piezo Benders

1. Overview

Buzzer elements and piezo benders are electroacoustic transducers based on the piezoelectric effect. Buzzer elements generate audible sound through mechanical vibration when subjected to an electric field, while piezo benders utilize flexible piezoceramic materials to convert electrical energy into mechanical displacement. These components play critical roles in modern electronics for audible alerts, precision actuation, and sensor applications.

2. Main Types and Functional Classification

Type Function Features Application Examples
Piezoelectric Buzzer Elements High-frequency tone generation, compact size, low power consumption Alarm systems, consumer electronics, medical devices
Single-layer Piezo Benders Simple structure, low-voltage operation, moderate displacement Valve control, microfluidic pumps, tactile feedback
Multi-layer Piezo Benders Amplified displacement, high force output, complex motion control Industrial automation, precision positioning, aerospace actuators
Surface-mount Piezo Devices Miniaturized SMD packaging, automated assembly compatibility Wearable devices, IoT sensors, automotive electronics

3. Structure and Composition

Typical construction includes:

  • Piezoceramic layer (PZT, PMN-PT materials)
  • Metal substrate (brass, stainless steel, or flexible PCB)
  • Electrode layers (silver, gold, or ITO coatings)
  • Protective encapsulation (epoxy resin or polymer coating)
Resonant cavity structures optimize acoustic performance in buzzers, while benders employ cantilever or unimorph designs for mechanical displacement.

4. Key Technical Specifications

Parameter Description
Operating Voltage 3-15V DC for buzzers, 10-200V AC for high-displacement benders
Resonant Frequency 1-10 kHz range determines audible pitch and efficiency
Sound Pressure Level (SPL) 70-110 dB at 10cm distance for buzzers
Displacement Range 0.1-5mm depending on layer configuration
Temperature Stability Operational range: -40 C to +85 C

5. Application Areas

  • Consumer Electronics: Smartwatches, smartphones, home appliances
  • Industrial Equipment: Machinery status alerts, valve actuators
  • Medical Devices: Infusion pumps, diagnostic equipment
  • Automotive Systems: Seatbelt reminders, fuel injector controls
  • Telecommunications: Network equipment alarms

6. Leading Manufacturers and Products

Manufacturer Representative Product
Murata Manufacturing PKMCS040A3H-Z
Panasonic Electronic Components ENV-40DRW
TE Connectivity 1-1431485-1
CUI Devices PB-4055-SMT

7. Selection Guidelines

Key considerations:

  • Required sound pressure level and frequency characteristics
  • Environmental conditions (temperature, humidity, vibration)
  • Power supply constraints and current limitations
  • Physical size and mounting method compatibility
  • Reliability requirements (MTBF > 100,000 hours typical)
For piezo benders, evaluate displacement-force trade-offs and actuation speed requirements.

8. Industry Trends

Emerging developments include:

  • Miniaturization for wearable device integration
  • Energy-efficient designs using novel piezoelectric materials
  • Integration with MEMS technology for smart actuators
  • Increased adoption in IoT sensors and haptic feedback systems
  • Development of lead-free piezoceramics for environmental compliance
Market growth projected at 6.2% CAGR through 2030 driven by automotive and medical electronics demand.

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