SIP1X27-014BLF

Manufacturer Part SIP1X27-014BLF
Manufacturer Storage & Server IO (Amphenol ICC)
Description CONN SOCKET SIP 27POS TIN
Category Connectors & Interconnects Supplier | Ample Chip Electronics Component
RoHS Lead free / RoHS Compliant
Warranty 365 days
Datasheet SIP1X27-014BLF PDF
Availability 0 pieces
Shipped from HK warehouse
Expected Shipping Dec 08 - Dec 12 2025
Quote Request

In Stock Min.: 1 Mult.: 1

Not satisfied with the price? Want a lower wholesale price? Please send RFQ, and we will respond immediately

Product Attributes
Type Description
Series:SIP1x
Package:Bulk
Part Status:Obsolete
Type:SIP
Number of Positions or Pins (Grid):27 (1 x 27)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Tin
Contact Finish Thickness - Mating:150.0µin (3.81µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:200.0µin (5.08µm)
Contact Material - Post:Brass
Housing Material:Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature:-
More Information
SIP1X27-014BLF
SIP1X27-014BLF
Storage & Server IO (Amphenol ICC) SIP1X27-014BLF is available at Ample-Chip.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.
Documents
Datasheet
SIP1X27-014BLF PDF
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Hot Sales parts
Payment
Payment method Hand Fee
Telegraphic Transfer Request service
Paypal 4% fee
Credit Card 4% fee
Western Union Free of charge
Money Gram Free of charge
Shipping
Shipping Type Lead Time
DHL 2-5 days
Fedex 2-5 days
UPS 2-5 days
TNT 2-6 days
EMS 3-7 days
Registered Air Mail 20-35 days
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