FI-XPB30SRL-HF11 JAE Electronics FI-XPB30SRL-HF11 inventory, pricing, datasheet

Manufacturer Part	FI-XPB30SRL-HF11
Manufacturer	JAE Electronics
Description	CONN RCPT 30P 0.039 GOLD SMD R/A
Category	Connectors & Interconnects Supplier \| Ample Chip Electronics Component
RoHS	Lead free / RoHS Compliant
Warranty	365 days
Datasheet	FI-XPB30SRL-HF11 PDF
Availability	0 pieces
Shipped from	HK warehouse
Expected Shipping	Dec 08 - Dec 12 2025

Product Attributes

Type	Description
Series:	FI-XP
Package:	Tray
Part Status:	Obsolete
Connector Type:	Receptacle
Contact Type:	Non-Gendered
Style:	Board to Cable/Wire
Number of Positions:	30
Number of Positions Loaded:	All
Pitch - Mating:	0.039" (1.00mm)
Number of Rows:	1
Row Spacing - Mating:	-
Mounting Type:	Board Edge, Cutout; Bottom Mount, Surface Mount, Right Angle, Reverse Mount
Termination:	Solder
Fastening Type:	Friction Lock
Contact Finish - Mating:	Gold
Contact Finish Thickness - Mating:	12.0µin (0.30µm)
Insulation Color:	Black
Insulation Height:	-
Contact Length - Post:	-
Operating Temperature:	-
Material Flammability Rating:	UL94 V-0
Contact Finish - Post:	Tin
Mated Stacking Heights:	-
Ingress Protection:	-
Features:	Grounding Pins, Shielded, Solder Retention
Current Rating (Amps):	-
Voltage Rating:	-

More Information

FI-XPB30SRL-HF11

JAE Electronics FI-XPB30SRL-HF11 is available at Ample-Chip.com. We only sale New&Original Part and offer 1 year warranty time. If you would like to know more about the products or apply more better price, please send a quote to us or contact us by email.