| Manufacturer Part | 5519S-1MIL |
|---|---|
| Manufacturer | 3M |
| Description | THERM COND PAD 1.0MM 155MMX210MM |
| Category | Fans & Thermal Management Supplier | Ample Chip |
| RoHS | Lead free / RoHS Compliant |
| Warranty | 365 days |
| Datasheet | 5519S-1MIL PDF |
| Availability | 0 pieces |
| Shipped from | HK warehouse |
| Expected Shipping | Dec 07 - Dec 11 2025 |
In Stock Min.: 1 Mult.: 1
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| Type | Description |
|---|---|
| Series: | 5519S |
| Package: | Bulk |
| Part Status: | Obsolete |
| Usage: | Thermally Conductive |
| Type: | Interface Pad, Sheet |
| Shape: | Rectangular |
| Outline: | 210.00mm x 155.00mm |
| Thickness: | 0.0390" (0.991mm) |
| Material: | Silicone Elastomer |
| Adhesive: | Tacky - One Side |
| Backing, Carrier: | Polyethylene-Naphthalate (PEN) |
| Color: | Gray |
| Thermal Resistivity: | - |
| Thermal Conductivity: | 4.9W/m-K |
| Payment method | Hand Fee |
| Telegraphic Transfer | Request service |
| Paypal | 4% fee |
| Credit Card | 4% fee |
| Western Union | Free of charge |
| Money Gram | Free of charge |
| Shipping Type | Lead Time |
| DHL | 2-5 days |
| Fedex | 2-5 days |
| UPS | 2-5 days |
| TNT | 2-6 days |
| EMS | 3-7 days |
| Registered Air Mail | 20-35 days |
THERM PAD 85X246X0.25MM GRAY
SNK PRE-PRINTED
CABLE GLAND 10-14MM M25 POLY
IC MCU 32BIT ROMLESS 236FBGA
LED 3MM GAP DIFF RED RA LEADS
THERM COND PAD 1.0MM 155MMX210MM
IC OSC SILICON 4.194304MHZ 8MSOP
