| Manufacturer Part | 133-7.5B |
|---|---|
| Manufacturer | Wakefield-Vette |
| Description | HEATSINK EXTRUDED |
| Category | Fans & Thermal Management Supplier | Ample Chip |
| RoHS | Lead free / RoHS Compliant |
| Warranty | 365 days |
| Datasheet | 133-7.5B PDF |
| Availability | 0 pieces |
| Shipped from | HK warehouse |
| Expected Shipping | Dec 09 - Dec 13 2025 |
In Stock Min.: 1 Mult.: 1
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| Type | Description |
|---|---|
| Series: | 133 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | Board Level |
| Package Cooled: | - |
| Attachment Method: | Bolt On |
| Shape: | Rectangular, Fins |
| Length: | 7.500" (190.50mm) |
| Width: | 7.000" (177.80mm) |
| Diameter: | - |
| Fin Height: | 3.125" (79.38mm) |
| Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | 0.09°C/W @ 500 LFM |
| Thermal Resistance @ Natural: | 0.28°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
| Payment method | Hand Fee |
| Telegraphic Transfer | Request service |
| Paypal | 4% fee |
| Credit Card | 4% fee |
| Western Union | Free of charge |
| Money Gram | Free of charge |
| Shipping Type | Lead Time |
| DHL | 2-5 days |
| Fedex | 2-5 days |
| UPS | 2-5 days |
| TNT | 2-6 days |
| EMS | 3-7 days |
| Registered Air Mail | 20-35 days |
MEMS OSC XO 27.0000MHZ CMOS SMD
CONN PLUG 6POS SMD GOLD
SWITCH TOGGLE DPDT 0.5VA 28V
HEATSINK EXTRUDED
IC VREF SERIES 0.04% 8LCC
MULTI-LAY HYBRID COUPLER 1206
CONN BACKSHELL ADPT SZ 10 BLK
